Semiconductor Latest News

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Marquee Semiconductor Expands Presence in India with New Location at Veer Surendra Sai University of Technology Campus in Odisha

Milpitas, CA — Marquee Semiconductor, a leading innovator in the semiconductor industry, is thrilled to announce the establishment of a new location at the Veer Surendra Sai University of Technology (VSSUT) campus, Burla, Odisha in India. This strategic move reinforces Marquee Semiconductor’s commitment to advancing technology and fostering talent in

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Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub

Milpitas, October 2nd, 2023. Marquee Semiconductor, a global leader in chip design solutions, is delighted to announce its collaboration with the Singapore Semiconductor Industry Association (SSIA), a pivotal step that reflects Marquee’s commitment to fostering the growth and advancement of the semiconductor ecosystem in Singapore. SSIA is the voice of

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Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect

press release

Barcelona, Spain – 3 October, 2023. There is an ever-increasing demand for more powerful chip designs for advanced applications, such as AI and ML, that require many cores on one chip. To facilitate this, Semidynamics and SignatureIP have partnered to integrate their respective IPs to provide a fully-tested RISC-V, multi-core

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ICsense achieves 14% revenue growth and EBITDA nearing 2 MEuro

press release

ICsense has announced its financial results for fiscal year 2022, showcasing a 14% boost in revenue, culminating in a revenue figure of 15.8 Million Euros. Driven by a stream of recurring product income, the company has also significantly enhanced its EBITDA, nearing the 2 Million Euro mark. “This achievement is

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The Ultimate Signoff (TapeOut) Checklist

In semiconductor design, “sign-off” during the tape-out (tapeout) of a chip refers to the formal approval process to ensure that the chip design is error-free, meets all specifications, and is ready for manufacturing at the foundry. It is essential because it minimizes the risk of costly errors, ensures compliance with

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The Ultimate Guide to RFIC

Radio Frequency Integrated Circuits (RFICs) represent the driving force behind the seamless connectivity and high-speed data transmission in our modern wireless world. These compact yet powerful integrated circuits are designed to operate at radio frequencies, making them essential components in everything from smartphones and Wi-Fi routers to advanced radar systems

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Chips&Media Announces the Release of “CMNP,” the New Neural Processor IP

news

Seoul, South Korea | Sep. 27, 2023 – Chips&Media, Inc. today announced the release of “CMNP” (Chips&Media Neural Processor) for customers who want value-added image enhancement features in deep learning-based video processing. They begin the promotion of CMNP in October 2023. Chips&Media is a worldwide leading hardware IP provider of

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Ashling’s RiscFree™ SDK Now Supports RISC-V® Processor Cores from CAST 

Woodcliff Lake, New Jersey and Limerick, Ireland — September 26, 2023 — Semiconductor intellectual property provider CAST and embedded tools developer Ashling today announced support for RISC-V® processor cores from CAST in Ashling’s RiscFree™ software development kit (SDK).
 
RiscFree is Ashling’s popular integrated development environment (IDE), and debugger for

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The Ultimate Guide to Semiconductor Packaging

Semiconductor packaging is a crucial aspect of electronics manufacturing that involves enclosing semiconductor chips in protective and functional packages to ensure their reliability, performance and integration into electronic devices. These packages serve as a bridge between the tiny, sensitive semiconductor chips and the broader electronic systems, providing electrical connections, thermal

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Q&A with Prasad Dhond, Vice President WBBGA and QFN Products, Amkor Technology Inc.

Tell us a bit about yourself and your background
 
I have worked in the semiconductor industry for 20+ years. I started at Texas Instruments where I held roles in engineering and marketing analog Integrated Circuits (ICs). After 12 years at TI, I joined Amkor where I currently hold P&L

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