Semiconductor Latest News

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CAST IP Helps Socionext Develop Advanced Autonomous Driving Systems

Woodcliff Lake, New Jersey and Yokohama, Japan, August 5, 2021 — IP cores and related support services from intellectual property provider CAST, Inc. have significantly facilitated the development of advanced automobile driving solutions by leading Systems-on-Chip provider Socionext, Inc.
 
Socionext serves customers worldwide by designing, developing, and delivering System-on-Chip

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ASIC explained in simple words

BGA

The ASIC acronym stands for Application Specific Integrated Circuits, which refers to an integrated circuit (IC or chip) tailored or customized for a specific purpose. A good example would be an ASIC designed to control the brake system in a car – this chip is designed only for this specific

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Chips&Media Expects a Supercycle in Semiconductors This Year

market research

Seoul, South Korea – August 05, 2021 – Chips & Media, which focuses on video codecs, computer vision (super-resolution), and semiconductor hardware intellectual property (IP) reported the 2021 performance today.
 
Chips&Media’s business activities, which earn 95% of its total earnings from exports, were restricted and limited in the first quarter

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Chip Design

Chip design is a process of designing a chip and is an essential part of electronics engineering. This process of chip design involves the knowledge of circuit design and its logic formation. All chips are made using basic elements which are known as transistors. The Metal Oxide Silicon Field Effect

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IP Core explained in simple words

wafer

Semiconductor Intellectual Property core, commonly referred to as IP Core or IP block, is a reusable, circuit, block, or design that is the intellectual property of someone or a company. It can, however, be licensed for use by another party.
 
IP Cores are very common in Application-Specific Integrated Circuits

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CAST And Avery Design Systems Expand IP Partnership to Support Next Generation High-Bandwidth Automotive Networking And Control Systems

Tewksbury, MA. and Woodcliff Lake, NJ. – July 27, 2021 – Avery Design Systems, a leader in functional verification solutions, and semiconductor intellectual property supplier CAST, Inc., announced today they have expanded their partnership to offer joint solutions supporting the design and verification of automotive SoCs that utilize the emerging

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Semiconductor Wafer Capacity by Geographic Region (2020)

IC Insights’ Global Wafer Capacity 2021-2025 report breaks out the world’s installed monthly wafer capacity by geographic region (or country).  Figure 1 shows the installed capacity by region as of December of 2020.
To clarify what the data represents, each regional number is the total installed monthly capacity of fabs located

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IC’Alps Partners with Marketing Platform AnySilicon

AnySilicon, the leading marketplace for ASIC service providers, announced today that IC’Alps, a fabless semiconductor company developing state-of-the-art fully custom Integrated Circuits (IC) combined with a complete management of the supply chain, has joined AnySilicon to promote its design & supply services. As part of the AnySilicon platform, IC’Alps will

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Will an Adhesion Promoter Prevent Delamination in Power Semiconductor Packages?

man holding a chip

Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is

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Worldwide IC Market Forecast to Top $500 Billion in 2021

market research

IC Insights will soon release its Mid-Year Update to The McClean Report that includes its most current forecast for the global IC market from 2021 through 2025.  In a very rare event, 32 of the 33 major IC market categories defined by WSTS are forecast to enjoy an increase in sales this year, with

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