The future of Semiconductor Packaging, Assembly and Test in the European Semiconductor Eco-System

Since mid of last year, our member ESPAT-Consulting is dedicating significant resources to SEMI Europe GmbH in Berlin, Germany, as one of the seven consortium core members of the EU CHIPS ACT driven Horizon Europe – Chips Joint Undertaking (JU) – Coordination and Support Action (CSA) – Project Pack4EU (Link: https://pack4eu.eu/). He is asking the AnySilicon community to also support this project.

If you are part of the European Semiconductor Eco-System and involved in Packaging, Assembly and Test, please support our analysis of the Semiconductor Packaging demand and offer sides and gap identification by participating in the survey: https://ec.europa.eu/eusurvey/runner/PACK4EUSurvey2023