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“Fan-out packaging continues to evolve, establishing a new market class, UHD Fan-Out,” asserts Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “Being actively explored and validated as one of the high performing and multi-die packaging platforms, Fan-Out Packaging is breaking through into new applications in 5G and HPC. In the Fan-Out Packaging: Technologies
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Plymouth, UK, 10th June 2020
Moortec today announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology. Moortec’s highly granular DTS offers a 7x area reduction in comparison to some standard in-chip thermal sensor solutions, and also supports high accuracy
As part of its May Update to the 2020 McClean Report, IC Insights compiled a list of semiconductor companies that have provided 2Q20 sales guidance. The list included companies from across all geographic regions and all product categories.
Because of uncertainty regarding the impact of Covid-19 on business in the second half of
Wichita, KANS. (June 2, 2020) – Integra Technologies, a world leader in semiconductor packaging, assembly, test, characterization and related services, was awarded a $3 million contract from Northrop Grumman.
Integra Technologies’ Wichita manufacturing facility will utilize upwards of one hundred current employees to service the new order. Integra Wichita will
The 10 largest suppliers of analog ICs collectively accounted for 62% or $34.2 billion of the $55.2 billion analog IC market in 2019. That was an increase of two points from 60% in 2018, according to data compiled and presented in the April Update to the 2020 McClean Report. The
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IC Insights will release its May Update to the 2020 McClean Report later this month. This Update is part of a series of monthly updates to The McClean Report that will be released through November of this year. The following evaluation of China’s IC market is an excerpt from the original McClean Report released in January.
IC production in
This is a guest post by Tim Penhale-Jones, EVP Sales and Marketing, Moortec
In the first of this blog trilogy, Talking Sense with Moortec…’Are you listening’, I looked at not waiting for hindsight to be wise after the event, instead make use of what’s available and act ahead of time.
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Hsinchu, Taiwan (May 21, 2020) –eMemory, the world’s leading supplier of intellectual property for NVM and security at the semiconductor level, is providing its intellectual property that ensures security in new chips for the narrowband-IoT (NB-IoT) market.
NB-IoT is a low-power wide area network (LPWAN) radio technology standard developed to
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it has successfully developed multiple next-generation display ASICs with key customers, these projects include 4K/8K UHD projectors, Pico displays, and automotive AR HUDs (heads-up display). Faraday also unveiled its all-inclusive display interface IP portfolio,
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