Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting and presenting at D&R IP-SoC Day on 13th September in Shanghai, China. Sankalp Semiconductor offers services and solutions to its customers in key semiconductor domains including digital, analog, mixed signal, custom
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IC Insights forecasts total semiconductor capital expenditures will rise to $102.0 billion this year, marking the first time that the industry has spent more than $100 billion on capital expenditures in one year. The $102.0 billion spending level represents a 9% increase over $93.3 billion spent in 2017, which was a
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GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients
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Innovative medical devices, autonomous vehicles, IoT applications, cloud based organizations, 5G communication networks and more high-end industries are basing their products on microelectronics and micro-optical components.
Constant reduction in chip size and uncompromising placement accuracy demands are some of the dominant challenges those industries are facing.
We, in Beckermus Technologies,
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it is leveraging Samsung FinFET platforms to extend its ASIC design solutions in next-generation applications, such as artificial intelligence (AI), 5G/infrastructure networking, blockchain, cloud storage, high-performance computing (HPC), AR & VR, and high-end imaging.
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IC Insights released its August Update to the 2018 McClean Report earlier this month. This Update included a discussion of the top-25 semiconductor suppliers in 1H18 (the top-15 1H18 semiconductor suppliers are covered in this research bulletin) and Part 1 of an extensive analysis of the IC foundry market and its suppliers.
The top-15 worldwide semiconductor (IC and O-S-D—optoelectronic, sensor,
Synopsys, Inc. (Nasdaq: SNPS) today announced a collaboration with IBM to apply design technology co-optimization (DTCO) to the pathfinding of new semiconductor process technologies for the 3-nanometer (nm) process node and beyond. DTCO is a methodology for efficiently evaluating and down-selecting new transistor architectures, materials and other process technology innovations
Read MoreThe demise of Qualcomm’s pending $44 billion purchase of NXP Semiconductors in late July along with growing regulatory reviews of chip merger agreements, efforts by countries to protect domestic technology, and the escalation of global trade friction all suggest semiconductor acquisitions are hitting a ceiling in the size of doable
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of the industry’s smallest USB 2.0 OTG PHY on UMC 40nm. The silicon-proven solution is targeted at consumer applications, such as MFP, DSC, USB portable devices, IoT, wearables, and MCU’s.
Faraday, a
Many admit that semiconductor manufacturing is the most complex and difficult manufacturing process that exist today. We agree. There are several ways to describe the Semiconductor manufacturing flow, but they are all boiled down to a very basic diagram.
The following diagram is a simplified flow describing the semiconductor