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Bangalore, India –26th September, 2018 – Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting at Taiwan Innotech Expo from 27-29th September in Taipei, Taiwan. Sankalp Semiconductor offers services and solutions to its customers in key semiconductor domains including digital,
Read MoreMCU sales and units shipments driven by the spread of embedded control in systems, more sensors, and the rush to connect end-use applications to the Internet of Things (IoT).
The market for microcontrollers—the IC industry’s original system-on-chip (SoC) product category—is expected to continue hitting record-high annual revenues
Read MoreFinding your ASIC unit cost is one of the most important steps prior to starting any ASIC design activities. If you are a semiconductor company – your company’s profit is highly dependent on the ASIC production cost. This post helps you understand the different cost components related to ASIC manufacturing.
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Amkor Technology announced on September 10th the opening of its new manufacturing and test plant at Longtan Science Park in Taiwan.
“Demand for Amkor’s advanced assembly and test services in Taiwan continues to increase. The opening of our fourth factory in Taiwan will allow us to keep
Read MoreTiming ECOs refer to last mile timing and DRC fixes before you tape-out the ASIC. EDA implementation tools (with help of physical design engineers) do 95-98% of the job when it comes to meeting the timing goals. For the last 1-2% timing violations, however, it is prudent to handle them
Read MoreSankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions, will be presenting paper at CDNLive India 2018 during 6th & 7th September. The selected paper talks in depth on the “Automated Test Case Creation for Design Rule Deck Validation (DRDV)”. The paper will cover the
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Wafer fabrication facilities, commonly known as wafer fabs, are the backbone of the semiconductor industry. These highly specialized factories process silicon wafers into integrated circuits (ICs) used in nearly every electronic device today. Let’s take a closer look at the global distribution and
Read MoreMoortec, providers of complete In-Chip Monitoring PVT Subsystems announced today that Tiannengbo Information Technology have utilised Moortec’s Temperature Sensor IP to optimise performance and increase reliability in their latest mining ASIC.
As a company Tiannengbo’s main focus is on chip and system design, production and sales. The company also
NXP Semiconductors N.V. (NASDAQ: NXPI), the world’s largest supplier of automotive semiconductors1, has acquired OmniPHY, a provider of automotive Ethernet subsystem technology. The company’s expertise includes automotive Ethernet, a technology that enables the rapid data transfer required for autonomous driving. OmniPHY’s advanced high-speed technology, combined with NXP’s leading portfolio and
Read MoreA smaller form-factor with higher data transfer rate, signal integrity, memory bandwidth, and thermal capability are all criteria for improving system performance. Today’s highly integrated and portable products strive to improve all of these metrics. Through Silicon Via (TSV) packaging technology enables homogenous and heterogeneous integration of logic and memory
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