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Coplanarity

The bottom surface of the package is parallel to the landing surface of the PCB.

Recent Stories

Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect

Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect

ICsense achieves 14% revenue growth and EBITDA nearing 2 MEuro

ICsense achieves 14% revenue growth and EBITDA nearing 2 MEuro

The Ultimate Signoff (TapeOut) Checklist

The Ultimate Signoff (TapeOut) Checklist

The Ultimate Guide to RFICs

The Ultimate Guide to RFICs

Chips&Media Announces the Release of “CMNP,” the New Neural Processor IP

Chips&Media Announces the Release of “CMNP,” the New Neural Processor IP

Ashling’s RiscFree™ SDK Now Supports RISC-V® Processor Cores from CAST

Ashling’s RiscFree™ SDK Now Supports RISC-V® Processor Cores from CAST

The Ultimate Guide to Semiconductor Packaging

The Ultimate Guide to Semiconductor Packaging

Q&A with Prasad Dhond, Vice President WBBGA and QFN Products, Amkor Technology Inc.

Q&A with Prasad Dhond, Vice President WBBGA and QFN Products, Amkor Technology Inc.