Coplanarity

The bottom surface of the package is parallel to the landing surface of the PCB.

Recent Stories

GlobalFoundries GaN Chip Manufacturing Advances with $9.5 Million U.S. Federal Funding

GlobalFoundries GaN Chip Manufacturing Advances with $9.5 Million U.S. Federal Funding

Global Semiconductor Sales Increase 22.1% Year-to-Year in October; Annual Sales Projected to Increase 19.0% in 2024

Global Semiconductor Sales Increase 22.1% Year-to-Year in October; Annual Sales Projected to Increase 19.0% in 2024

ASIC supplier ICsense selected for GlobalFoundries’ official design partner network

ASIC supplier ICsense selected for GlobalFoundries’ official design partner network

Advanced Processes and Chinese Policies Drive 3Q24 Global Top 10 Foundry Revenue to Record Highs, Says TrendForce

Advanced Processes and Chinese Policies Drive 3Q24 Global Top 10 Foundry Revenue to Record Highs, Says TrendForce

VSMC Celebrates Breaking Ground on 300mm Fab in Singapore

VSMC Celebrates Breaking Ground on 300mm Fab in Singapore

China Imposes Export Restrictions on Key Minerals to the United States

China Imposes Export Restrictions on Key Minerals to the United States

TSMC Accelerates Construction of its First 2-Nanometer Fab in Kaohsiung, Taiwan

TSMC Accelerates Construction of its First 2-Nanometer Fab in Kaohsiung, Taiwan

Vishay Intertechnology Invests £51 Million in Newport Semiconductor Plant, Boosting Welsh Economy

Vishay Intertechnology Invests £51 Million in Newport Semiconductor Plant, Boosting Welsh Economy