http://www.aptasic.ch
2166 Views

Die Attach Process

December 10, 2014, anysilicon

Is a step within an assembly process that is fixing a chip on a leadframe or a substrate or an interposer.

Recent Stories

Faraday Unveils RISC-V ASIC Solution to Support Edge AI and IoT SoCs
Faraday Unveils RISC-V ASIC Solution to Support Edge AI and IoT SoCs
Attopsemi’s I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology
Attopsemi’s I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology
CEO Talk: George Dimitropoulos of ADVEOS
CEO Talk: George Dimitropoulos of ADVEOS
Proven technology significantly reduces risk, time-to-market and overall cost
Proven technology significantly reduces risk, time-to-market and overall cost
TSMC and OIP Ecosystem Partners Deliver Industry’s First Complete Design Infrastructure for 5nm Process Technology
TSMC and OIP Ecosystem Partners Deliver Industry’s First Complete Design Infrastructure for 5nm Process Technology
Fabless Company Sales By Region 2018
Fabless Company Sales By Region 2018
proteanTecs Completes Successful Series B Funding and Launches Out of Stealth Mode
proteanTecs Completes Successful Series B Funding and Launches Out of Stealth Mode
Short Guide to Selecting IC Package
Short Guide to Selecting IC Package

Find Vendors IP Cores

Find ASIC Vendors

Find IP Vendors

Get Price Offers From
Welcome New Vendors
Answer a Question
Recent Semipedia Items
Recent Posts
Most Popular Blog Posts
Tools
AnySilicon

Copyright 2011-2018, AnySilicon. All rights reserved.

Follow Us

Semiconductor Services

We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies from this website.