Die Bonding
Die bonding is a relatively simple and low cost process of connecting die pads to a substrate, a leadframe or a PCB as part of the assembly process. Today, die bonding is used in most of semiconductor products.
Die bonding is a relatively simple and low cost process of connecting die pads to a substrate, a leadframe or a PCB as part of the assembly process. Today, die bonding is used in most of semiconductor products.
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