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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Manufacturing Services, Failure Analysis & Characterization, Design Services
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Wafer Storage & Processing, Assembly Services, Electrical Test Services, Analytical Services, Reliability Testing
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Custom Analog Mixed-Signal ASIC Solutions, ASIC, SoC, FPGA Design Services, Design Verification, Silicon Validation, IC Design Services, DFT Services
Microcontrollers and IDE solution, Custom Memory IP and I/Os, DDR3/DDR2 Memory Controller, 3D Graphics Processor for Wearables/IoT, Gigabit Ethernet PHY Cores, Wired and Wireless Connectivity
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