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IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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GHz ADC and DAC for 5G, Radar applications, 24b ADC and AFE for sensor, medical, Industrial process control, seismic & metering business, 12b 16b ADC, AFE for embedded microcontroller, precision motor control applications, Mic Bias, 18b Audio ADC and 24b Audio DAC for audio and ANC applications, ADC and DAC for WIFI, Bluetooth, DOSCIS, STB applications, Precision reference, RC oscillator, crystal oscillator, charge pump, LDO, Temperature sensor, Bandgap, power on reset, Charge pump, Programmable gain amplifier, High valued ICs
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