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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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FPGA to ASIC Conversion and Replacement, Turnkey ASIC Design and Manufacturing, Legacy Microprocessor Replacement, Analog/Mixed Signal ASIC Design and Manufacturing , Defense, Medical and High Temperature Applications, Legacy FLASH Memory Replacement
Legacy Microcontroller Families, Analog Blocks, FLASH Memory, Serial Interface Modules
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PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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Design Verification, Design Implementation (RTL to GDSII), RTL Design, Design for Test (DFT), Analog & Mixed Signal Design, Emulation and Post Silicon Validation
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Full turnkey ASIC, IC design services, Analog and mixed signal IP, Supply Chain Management, Team augmentation
Power Management, Data Converters, Clock Management, Sensors , Front Ends
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