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Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Design Services
Standard Cells Libraries, TCAM & CAM, SRAM & ROM, Custom PDK and PCELL, Register Files
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