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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Turnkey ASIC Design, Turnkey ASIC Supply, High-Voltage Design, Sensors & MEMS Expertise, Ultra-Low Power Design, Precision Analog & Data Converter Design
Data Converters, RF Circuits, Analog Amplifiers and Comparators, High Voltage Drivers/Interfacing, Serial Communications, Power Management and References
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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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