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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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ASIC/FPGA Design Services, Analog & Mixed Signal Design, Custom Layout, Digital Design Services, Foundry Services, Post Silicon Validation Services, SoC Turnkey Design
IP Marketplace
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Logic Design (Front-End), ASIC Design RTL to GDS2, Analog & RF Design, Productization, Production, Additional Services
CPU & SoC, Security, General Purpose IP, Analog IP
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