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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Design Services
Standard Cells Libraries, TCAM & CAM, SRAM & ROM, Custom PDK and PCELL, Register Files
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Turnkey ASIC Design, IP Blocks Design, Radioelectronic Devices Development
RF Transceivers, PLL, ADC, Process, Voltage and Temperature Sensors (PVT sensor/detector/controller), RFID (UHF tag, ID card, NFC, medical implants), Energy harvesting (power converters from RF-field to voltage and current)
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Spec2parts, FPGA Prototyping & Validation, Derivative Chips, Automotive Chips, Chiplets, IP Hardening
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Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
Column ADC Patent, Extensive IP Library
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