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Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services
USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield
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Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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