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Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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Logic Design (Front-End), ASIC Design RTL to GDS2, Analog & RF Design, Productization, Production, Additional Services
CPU & SoC, Security, General Purpose IP, Analog IP
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Front End Design, Design Verification, Physical Design & Sign Off, Design for Testability (DFT), FPGA Design, Analog Design
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Design Verification, Physical Design , Design for Test (DFT) , Analog & Mixed Signal (AMS) Design, Embedded & Product Engineering Services
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Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
Column ADC Patent, Extensive IP Library
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