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USA
QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
View vendor pageFrance
EASii IC is a design house developing high performances ASIC, from 0.35µm down to 10nm, including FD-SOI.
ASIC design, ASIC verification, System validation and industrialization , Full turnkey
View vendor pageCVC is worldwide leader in providing Design-Verification training, services & custom Verification IPs for 10+ years.
The Netherlands
ASIC supply chain partner with competitive solutions for IC manufacturing, packaging and test, lower volumes are welcome too.
Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
View vendor pageUSA
OpenFive provides System-Optimized ASIC Solutions from Concept to Volume Production. Also, OpenFive offers a wide-portfolio RISC-V Processor IP Cores and SoC IPs.
Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management
OpenFive HBM2/2E (High Bandwidth Memory) Subsystem IP, OpenFive Interlaken IP Core, OpenFive MCMR FEC (Forward Error Correction) IP Core, OpenFive 400/200/100G Ethernet PCS IP, OpenFive 400/200/100G Ethernet MAC IP, OpenFive FlexE (Flexible Ethernet) IP, OpenFive USB3.2 Gen2 single lane Re-Timer IP Core, OpenFive USB3.0 DR-OTG Controller IP Cores, OpenFive USB3.2 Gen2 IP Core, OpenFive Die-to-Die Controller IP
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