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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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RTL Design, RTL Design Verification, DFT, Netlist to GDS, Analog Circuit and Layout, Post Silicon Services
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Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
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Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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