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Featured Vendor

Experior

Experior

Malaysia

Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.

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Swindon Silicon Systems

Swindon Silicon Systems

UK

Swindon is a leader in the design, production test and supply of industrial and automotive mixed signal ASICs (Custom ICs).

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DXCorr Design

DXCorr Design

USA

DXCorr designs memory compilers as well as standard cell libraries to meet the stringent requirements for SoC designs.

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Device Engineering Incorporated

Device Engineering Incorporated

USA

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

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Atek Midas

Atek Midas

Turkey

ATEK is a tech company, working on high frequency circuit design. ATEK focuses on providing design and development services from RFIC/MMIC components to Microwave/mm-wave Subsystems based on customer needs.

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IC-Logic

IC-Logic

Germany

IC-LOGIC is a Microchip design company with focus on analog, digital and mixed signal ASIC designs.

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Semiconductor News

CEO Talk: Mayank Varshney, VP of Engineering, Mirafra Inc
CEO Talk: Mayank Varshney, VP of Engineering, Mirafra Inc
IC Package Types and How to Choose One?
IC Package Types and How to Choose One?
CEO Talk: Bram De Muer of ICsense
CEO Talk: Bram De Muer of ICsense
Multi Project Wafer (MPW) Service and Price
Multi Project Wafer (MPW) Service and Price
VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
What does a VLSI Engineer do?
What does a VLSI Engineer do?
What is an ASIC Engineer?
What is an ASIC Engineer?
ASIC Design: From Spec to Chips
ASIC Design: From Spec to Chips

Latest Articles

ASIC Design

CEO Talk: Mayank Varshney, VP of Engineering, Mirafra Inc
CEO Talk: Mayank Varshney, VP of Engineering, Mirafra Inc
CEO Talk: Bram De Muer of ICsense
CEO Talk: Bram De Muer of ICsense
What does a VLSI Engineer do?
What does a VLSI Engineer do?

IP Cores

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries’ 12LP Process
QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries’ 12LP Process
Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core
Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core

ASIC Industry Market Trends

Introduction to eDRAM
Introduction to eDRAM
CEO Talk: Michael Dube, EVP at Rochester Electronics
CEO Talk: Michael Dube, EVP at Rochester Electronics
HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering
HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering

Wafer and Foundries

Multi Project Wafer (MPW) Service and Price
Multi Project Wafer (MPW) Service and Price
Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023
Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023
Semiconductor Foundry Revenue 2023-2024
Semiconductor Foundry Revenue 2023-2024

Packaging

IC Package Types and How to Choose One?
IC Package Types and How to Choose One?
Understanding CoWoS Packaging Technology
Understanding CoWoS Packaging Technology
First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering
First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

Verification

The Ultimate Guide to ASIC Verification
The Ultimate Guide to ASIC Verification
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Constrained Random Verification flow strategy
Constrained Random Verification flow strategy

Testing

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering
First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering
Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing
Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing
Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan
Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan

Qualification

Managing Space Grade RF Device Qualifications
Managing Space Grade RF Device Qualifications
Criteria Labs Expands Manufacturer’s Representatives to Better Serve Customers Throughout the United States and Canada
Criteria Labs Expands Manufacturer’s Representatives to Better Serve Customers Throughout the United States and Canada
Understanding High Temperature Storage Life (HTSL) in IC Qualification
Understanding High Temperature Storage Life (HTSL) in IC Qualification

Supply Chain

CEO Talk: Michael Dube, EVP at Rochester Electronics
CEO Talk: Michael Dube, EVP at Rochester Electronics
The Economics of ASIC
The Economics of ASIC
Obsolete Chips – The Ultimate Guide
Obsolete Chips – The Ultimate Guide

Failure Analysis

FIB Circuit Edit
FIB Circuit Edit
Best Practices: IC Troubleshooting & IC Failure Analysis
Best Practices: IC Troubleshooting & IC Failure Analysis
Focused Ion Beam (FIB)
Focused Ion Beam (FIB)
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