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Featured Vendors

Key ASIC

Malaysia

Key ASIC offers turnkey ASIC/SoC design services, specializing in AI, IoT, and medical applications with a focus on PPA optimization.

CSEM

Switzerland

Leader in ultra low power analogue and mixed signal ASIC design and IP licensing, including RF, image sensor and SOC.

We deliver industrial ASIC turnkey solutions from specification to mass production, leveraging over 10 foundries including the world's largest.

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Aptasic

Switzerland

Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.

IMEC

Belgium

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

SMIC

China

SMIC is one of the leading semiconductor foundries, providing integrated circuit (IC) foundry and technology services at 0.35um to 40nm.

Asicland

Republic of Korea

Asicland provides ASIC turnkey services as a TSMC VCA partner. Backed by 400+ tape-out records, we help customers accelerate reliable silicon projects, including tape-out support for design-complete projects.

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

SGA

Sweden

SGA designs and manufactures mixed-signal, full-custom ASIC's for primarily industrial applications world-wide.

Experior

Malaysia

Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

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