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Featured Vendors

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

ASTC is integral to the global embedded electronics supply chain, supplying semiconductors, IP and software, to OEM and systems companies.

GEDEC

Italy

GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Atek Midas

Turkey

ATEK is a tech company, working on high frequency circuit design. ATEK focuses on providing design and development services from RFIC/MMIC components to Microwave/mm-wave Subsystems based on customer needs.

ShortLink

Sweden

Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.

AI-generated, human-verified RTL for custom designs and IP blocks.

IMMS GmbH

Germany

Design, verification, and test of analog, digital, and mixed-signal ICs. Specialized in biomedical and optical applications. Premium partner of X-FAB.

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

Green Mountain Semiconductor provides full custom circuit design and layout services, from individual expert contracting to turn-key product development.

Sigenics Inc. specializes in designing, testing and delivering custom integrated circuits for sensor, analog, and mixed-signal applications within various markets.

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

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