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Featured Vendors

Micross… The Most Complete Provider of Hi-Rel Microelectronics, Die & Wafer, and Semiconductor Services.

IMMS GmbH

Germany

Design, verification, and test of analog, digital, and mixed-signal ICs. Specialized in biomedical and optical applications. Premium partner of X-FAB.

Creonic

Germany

Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.

Established in 2003, KAL provides semiconductor deep tech consultancy and ASIC program management. KAL works with worldwide partners to deliver VLSI deep tech development, including digital, RF, and analog ASIC design services, supply chain services, IP cores, and libraries. We are capable of executing full spec to production projects and delivering fully tested ICs in high volume.

ChipGlobe

Germany

ChipGlobe offers ASIC/FPGA Design Services in Design Centers in Munich, Belgrade, Singapore: RTL2GDS, Functional Verification, Embedded Systems + Prototypes.

Noesis Technologies is a Silicon IP provider specialized in hardware implementation of complex telecom algorithms for wireless and wireline applications.

We deliver industrial ASIC turnkey solutions from specification to mass production, leveraging over 10 foundries including the world's largest.

ShortLink

Sweden

Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.

Cyient Semiconductors is a fabless provider delivering custom ASICs, ASSPs, and custom products with end-to-end design and global engineering expertise.

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

SignOff Semiconductors

USA, India, Israel

SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

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