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Featured Vendor

Moortec

Moortec

UK

Moortec provides compelling embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies from 40nm down to 7nm.

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Integrated Detector Electronics AS (IDEAS)

Integrated Detector Electronics AS (IDEAS)

Norway

Design and supply of integrated circuits and systems for sensing, detection and imaging applications in special operations and environments.

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T2M

T2M

Germany

Global Semiconductor IP provider for accelerated SoC development in mobile, IoT and Wearables markets.

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Elsys America

Elsys America

USA

ELSYS America provides cost-optimized ASIC, SoC and FPGA design services and solutions, from concept to silicon.

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Inomize

Inomize

Israel

Inomize is specializing in the delivery of full turn-key complex ASIC and HW project from spec to production.

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Semiconductor News

Achronix Selects Moortec’s 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
Achronix Selects Moortec’s 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
Worldwide IC Company Market by Location – 2018
Worldwide IC Company Market by Location – 2018
Morse Micro Partners with SiFive to Host Tech Symposium on RISC-V in Sydney
Morse Micro Partners with SiFive to Host Tech Symposium on RISC-V in Sydney
CSEM and MIFS demonstrate world-record lows in energy consumption for a microcontroller.
CSEM and MIFS demonstrate world-record lows in energy consumption for a microcontroller.
Can We Believe The Hype About China’s Domestic IC Production Plans?
Can We Believe The Hype About China’s Domestic IC Production Plans?
Silex Insight now supports 1GbE, 2.5GbE & 10GbE with their AV over IP OEM boards
Silex Insight now supports 1GbE, 2.5GbE & 10GbE with their AV over IP OEM boards
HDL Design House Adds New Representative in Europe
HDL Design House Adds New Representative in Europe
Overview and Types of Capacitors in ASIC Design
Overview and Types of Capacitors in ASIC Design

Latest Articles

ASIC Design

HDL Design House Adds New Representative in Europe
HDL Design House Adds New Representative in Europe
IoT – You Ain’t Seen Nothing Yet
IoT – You Ain’t Seen Nothing Yet
asicNorth helps StretchSense drive wearables to become “disappearables” in the new ZozoSuit by Start Today
asicNorth helps StretchSense drive wearables to become “disappearables” in the new ZozoSuit by Start Today

IP Cores

Achronix Selects Moortec’s 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
Achronix Selects Moortec’s 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
White Paper: Enabling Server-Class Storage in Embedded Applications
White Paper: Enabling Server-Class Storage in Embedded Applications
Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution
Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution

ASIC Industry Market Trends

Worldwide IC Company Market by Location – 2018
Worldwide IC Company Market by Location – 2018
DRAM Growth Tops Industry Ranking in 2018; Outlook Dims for 2019
DRAM Growth Tops Industry Ranking in 2018; Outlook Dims for 2019
The 6 Must-Do’s for Fabless Start-ups
The 6 Must-Do’s for Fabless Start-ups

Wafer and Foundries

Can We Believe The Hype About China’s Domestic IC Production Plans?
Can We Believe The Hype About China’s Domestic IC Production Plans?
TowerJazz Completes Acquisition of Maxim’s Fab
TowerJazz Completes Acquisition of Maxim’s Fab
92 IC Wafer Fabs Closed or Repurposed From 2009-2017
92 IC Wafer Fabs Closed or Repurposed From 2009-2017

Packaging

Short Guide to Selecting IC Package
Short Guide to Selecting IC Package
TSMC will enter the fan out wafer level package business
TSMC will enter the fan out wafer level package business
Packaging and Delivery Methodology for: wafer, die and ICs
Packaging and Delivery Methodology for: wafer, die and ICs

Verification

Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Don’t Get Critical IP Cores from a ‘Supermarket’
Don’t Get Critical IP Cores from a ‘Supermarket’
Efficient Verification and Virtual Prototyping of Analog and Mixed-Signal IP and SOCs Using Behavioral Models
Efficient Verification and Virtual Prototyping of Analog and Mixed-Signal IP and SOCs Using Behavioral Models

Testing

Presto Engineering’s Extensive Test Capabilities Enable It to Offer Customers Parallel Testing of Automotive Products to Provide Much Faster Time to Market
Presto Engineering’s Extensive Test Capabilities Enable It to Offer Customers Parallel Testing of Automotive Products to Provide Much Faster Time to Market
Presto Engineering Launches New Image Sensor Turnkey Services
Presto Engineering Launches New Image Sensor Turnkey Services
Overview and Dynamics of Scan Chain Testing
Overview and Dynamics of Scan Chain Testing

Qualification

Understanding High Temperature Storage Life (HTSL) in IC Qualification
Understanding High Temperature Storage Life (HTSL) in IC Qualification
Understanding ESD CDM in IC Design
Understanding ESD CDM in IC Design
Understanding ESD HBM in IC Design
Understanding ESD HBM in IC Design

Supply Chain

CoreHW and RoodMicrotec to establish long-term supply chain partnership
CoreHW and RoodMicrotec to establish long-term supply chain partnership
Moisture Sensitivity Level and Popcorn Effect
Moisture Sensitivity Level and Popcorn Effect
Process Control in High Volume Semiconductor Manufacturing
Process Control in High Volume Semiconductor Manufacturing

Failure Analysis

Best Practices: IC Troubleshooting & IC Failure Analysis
Best Practices: IC Troubleshooting & IC Failure Analysis
Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers
Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers
Focused Ion Beam (FIB)
Focused Ion Beam (FIB)
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