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Featured Vendors

Device Engineering Incorporated

USA

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

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GS Microelectronics

USA

GSME is a global provider of customized silicon solutions including RF design, power management ICs, manufacturing operations, and Quality Assurance (QA) to IC design and system companies.

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Swindon Silicon Systems

UK

Swindon is a leader in the design, production test and supply of industrial and automotive mixed signal ASICs (Custom ICs).

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Presto Engineering

France

Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

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Advanced Sensor Integrations

USA

ASI develops custom Analog and Mixed-Signal IC chips & IP blocks. Company is located in San Jose since 2008.

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Chipus Microelectronics

Brazil

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

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Chiplet Summit 2025



January 21, 2025 – January 23, 2025
Why should we go
UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance
Dec-16-2024 — United Microelectronics Corporation (UMC) (TW:2303) today announced a significant breakthrough
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12 Dec 2024 — SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS)
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MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC
Hyderabad, India — December 11, 2024 — MosChip® Technologies selects Cadence 5nm EDA
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry

ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have
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[December 9, 2024] – A groundbreaking new report, “Chiplet Technology 2025-2035: Technology,

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