The Google of the Semiconductor Industry

SkyWater Technology specializes in new technology process development and volume manufacturing ICs for mil/aero, consumer, medical, industrial and automotive markets.

Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.

Know-how and lengthy experience is what makes us successful in the design of analog, digital and Mixed-Signal ASICs. Your partner for future-oriented, Cost-optimized ASIC solutions.

InCirT is a German company that provides ultra-wideband data converters, ultra-low jitter programmable PLLs, high-speed interface, and many other IPs.

Established in 1987, TSMC is the world's largest dedicated semiconductor foundry.

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

ChipGlobe offers ASIC/FPGA Design Services in Design Centers in Munich, Belgrade, Singapore: RTL2GDS, Functional Verification, Embedded Systems + Prototypes.

GLOBALFOUNDRIES is the world’s first full-service semiconductor foundry with a truly global footprint.

SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.

ams OSRAM, a global leader in light and sensor solutions with over 110 years of experience, combines engineering excellence and manufacturing to innovate in sensing, illumination, and visualization across various industries.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.