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Featured Vendors

Kamaten primary business is development and maintenance of Analog and Mixed Signal IP portfolio. We are also a design service provider.

Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.

Seamlessly Bridging the Analogue and Digital Worlds for Tomorrow's Chiplet Solutions.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

ASTC / IQonIC Works is an Australian semiconductor company developing RISC-V microcontroller ICs and application-specific silicon solutions for embedded and industrial applications.

NTLab

Lithuania

ASIC design service and silicon IP provider specializing in analog/mixed-signal and RF design (GNSS, RFID, telecom, medical, sensors).

CSS, a fabless semiconductor leader with 30 years of experience, develops and supplies mixed-signal ASICs to Industrial, Aerospace/Defense, and Medical markets.

Micross… The Most Complete Provider of Hi-Rel Microelectronics, Die & Wafer, and Semiconductor Services.

Tekmos

USA

Tekmos delivers ASIC solutions replacing FPGAs, ASICs, Legacy Microprocessors and Flash Memory. Tekmos supports Defense, Medical and High Temperature applications.

Experior

Malaysia

Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.

IMMS GmbH

Germany

Design, verification, and test of analog, digital, and mixed-signal ICs. Specialized in biomedical and optical applications. Premium partner of X-FAB.

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

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body{font-family:Arial,Helvetica,sans-serif;color:#222;line-height:1.72;margin:0;background:#fff} article{max-width:980px;margin:0 auto;padding:18px 18px 48px} h1{font-size:38px;line-height:1.18;margin:0 0 20px} h2{font-size:28px;line-height:1.3;margin:36px 0 14px}
Advanced packaging has become the place where AI system performance ...

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