IC Packaging Design Engineer

We are seeking a highly skilled IC Package Design Engineer to contribute to a new product development project. This role requires expertise in IC packaging design and a strong background in electrical or electronics engineering.

Responsibilities:

• Design and implement IC packaging solutions for new products.
• Ensure design compliance with industry standards and specifications.
• Collaborate with cross-functional teams to optimize design for performance and manufacturability.
• Conduct substrate design and layout, focusing on SI/PI aware design implementation.
• Evaluate and enhance design for yield and reliability.

Qualifications:

• Bachelor’s or Master’s degree in Electrical/Electronics Engineering.
• Proven experience in IC package design.

Skills:

• Strong hands-on experience with Siemens (Mentor) Xpedition (XPD) or Cadence Allegro/Advanced Package Designer (APD/SIP).
• Expertise in physical design and layout.
• Knowledge of design rule compliance and best practices in IC packaging.