TES Electronic Solutions GmbH announces the availability of its new DC-DC converter IP, TS_SPLITPI_3V3_X8, a cascaded 3.3 V boost‑buck converter that can be powered from either a 10 V – 30 V supply or a low-voltage backup battery and is implemented in X-FAB XT018 – 0.18µm BCD-on-SOI technology. The circuit implements the well‑known Split‑Pi topology, offering designers a simple way to achieve high efficiency and precise regulation.
The IP can be found here:
Key Benefits
TES will make supporting your design effort a priority – whether it is integrating this IP into your design or implementing a complete ASIC.
For more information on this and other IP solutions, visit the TES IP products page.
Contact
For inquiries, please email sales_dst@tes-dst.com
Visit our dedicated ASIC design service portal at https://asicentwicklung.de/ for further technical information and service details.
About TES
With over 20 years of experience in ASIC design and embedded graphics IP, TES is a one-stop partner for high-performance semiconductor solutions. Our IP portfolio includes highly customizable 2D, 2.5D, and 3D GPUs, display controllers, and a wide range of analog and digital IP blocks, ranging from SiGe RF to industrial ASIC solutions.
Headquartered near Stuttgart, Germany, TES Electronic Solutions GmbH serves a global customer base, with design operations in Stuttgart and graphics IP development in Hamburg. Learn more at www.tes-dst.com.
