Featured Vendor

Sencio

The Netherlands

Sencio develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

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SMART Microsystems

USA

SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products.

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Ardentec

Singapore

Global Wafer Test Service provider. Services include Test Program Development and Platform migration, Optimization, Yield Improvement, Laser Dicing, Stud Bump.

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EASii IC

France

EASii IC is a design house developing high performances ASIC, from 0.35µm down to 10nm, including FD-SOI.

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FrenusTech

India

We provide Solutions / Engineering Talent: To build Intellectual Properties (IPs) and System On Chips (SOC) involving both Digital & Analog design for Accelerator based SOCs, Consumer Electronics, IOTs, Automotive and Aerospace.

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