Woodcliff Lake, New Jersey — March 12th, 2025 — CAST, a leading provider of silicon intellectual property (IP) solutions, and Shikino High-Tech Co., Ltd., a Japanese company specializing in semiconductor design, imaging, sensing, and testing technologies, announced a new strategic partnership aiming at expanding both companies’ reach and offerings in
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New Delhi — March 10, 2025 – Logic Fruit Technologies, a leading provider of cutting-edge FPGA-based solutions, proudly announces the release of its latest High-Speed Interface IP stack, including PCIe Gen6 Controller IP, PCIe Gen6 PHY IP, and CXL 3 Controller IP.
These high-performance solutions enable seamless data transfer, ensuring reliability, scalability, and
The PCIM Europe Expo & Conference in Nuremberg, Germany, is the premier international event for power electronics, intelligent motion, renewable energy, and energy management. As the leading forum for industry and academia, PCIM Europe drives innovation across the entire value chain, making it the established home of power electronics for
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March 10, 2025 —- TrendForce’s latest research reveals that the global foundry industry exhibited a polarized trend in 4Q24. Advanced process nodes benefited from strong demand in AI servers, flagship smartphone application processors (APs), and new PC platforms, driving high-value wafer shipments. This growth helped offset the slowdown in mature process
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SCOTTSDALE, Ariz. – March 5, 2025 – onsemi (NASDAQ: ON) today disclosed details of a proposal submitted to the Board of Directors of Allegro MicroSystems, Inc. (“Allegro”) (NASDAQ: ALGM) to acquire the company for $35.10 per share in cash for each share (the “Proposal”) of Allegro’s common stock
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March 6, 2025 – EnSilica plc (AIM:ENSI), a leading chip maker of mixed signal ASICs (“Application Specific Integrated Circuits”), is pleased to announce that it has been awarded a €2.13 million development contract under the European Space Agency’s (“ESA”) Navigation Innovation and Support Programme (“NAVISP”) Element 2 (the “Project”).
Under