Woodcliff Lake, New Jersey — March 8, 2023 — Semiconductor intellectual property provider CAST today announced the immediate availability of a new digital audio transceiver IP core that provides both Inter-IC Sound (I2S) and Time-Division Multiplexed (TDM) interfaces.
The new I2S-TDM I2S/TDM Multichannel Audio Transceiver has critical features and
Woodcliff Lake, New Jersey — March 3, 2023 — Semiconductor intellectual property provider CAST today announced the immediate availability of a new deeply embedded, low-power RISC-V processor IP core and enhancements to its functional safety RISC-V processor IP core.
New Low-Power Embedded RISC-V Processor
The BA5x™ RISC-V Deeply Embedded
SAN JOSE, California – Mar 01, 2023 – Omni Design Technologies, a leading provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions today announced that it has received ISO 9001 certification for the design and development of high performance, ultra-low power IP cores.
Omni Design’s objective is to provide customers
The top 10 global original equipment manufacturers (OEMs) decreased their chip spending by 7.6% and accounted for 37.2% of the total market in 2022, according to preliminary results by Gartner, Inc. Global inflation and recession pressures sharply weakened demand for PCs and smartphones in 2022, impacting global OEMs production.
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Oxford, UK – 17 February 2023 – EnSilica (AIM:ENSI), a leading ASIC and mixed signal chip maker, has announced a contract to develop a new chip to address the next generation of mass market satellite broadband user terminals.
The contract has been awarded through the European Space Agency’s (ESA)
Cesson-Sévigné (France) / Cork (Ireland), February 23, 2023 – Secure-IC, the rising leader and unique global provider of end-to-end cybersecurity solutions for embedded systems and connected objects, and Trasna, an IoT secure hardware and software specialist, announce today they have succeeded to offer a groundbreaking Physically Unclonable Function (PUF) solution.
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