Category Archives: ASIC Design

Design Challenges in Single-Digit Technology Nodes

The advancement of semiconductor technology has led to the development of smaller and more efficient electronic devices. This progress is driven by the continuous scaling of integrated circuits, resulting in the introduction of lower technology nodes (such as 5nm, 3nm and 2nm). While these nodes offer numerous benefits, they also

Read More

Marquee Semiconductor Partners with AnySilicon

news

AnySilicon, the leading marketplace for ASIC service providers, announced today that Marquee Semiconductor, an innovative provider of semiconductor design services with technical expertise in connectivity, has partnered with AnySilicon to promote its capabilities to new customers. As part of the AnySilicon platform, Marquee Semiconductor will gain access to a full

Read More

The Ultimate Guide to Memory Compiler

In the field of semiconductor design, memory compilers are software tools used to automate the process of designing and generating memory circuits for use in integrated circuits (ICs). These memory circuits can include static random access memory (SRAM), read-only memory (ROM), and dynamic random access memory (DRAM), among others.
 
Read More

10 Most Important Tips For Physical Design Engineers

wafer

In this post, we will highlight some tips for a physical design engineer that they might find useful in their job:

 
1. A Script in Time Saves Nine

Just like any job, physical design can be repetitive. Scripting serves two purposes:
 

Automating repetitive tasks: Any

Read More

HDL Design House develops its first full SoC from architecture definition to tapeout for an external customer

news

April 27, 2023 — Belgrade, Serbia – HDL Design House, a leading provider of digital and analog design and verification services for the most complex SoC projects, announced today that they have successfully developed and implemented its first full SoC starting from architecture definition to tapeout phase. SoC is intended for

Read More

ESA and UKSA back EnSilica to develop satellite communications chip for terminals

Oxford, UK – 17 February 2023 – EnSilica (AIM:ENSI), a leading ASIC and mixed signal chip maker, has announced a contract to develop a new chip to address the next generation of mass market satellite broadband user terminals.
 
The contract has been awarded through the European Space Agency’s (ESA)

Read More
Logo Image
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.