Category Archives: ASIC Design

The Ultimate Guide to Memory Compiler

In the field of semiconductor design, memory compilers are software tools used to automate the process of designing and generating memory circuits for use in integrated circuits (ICs). These memory circuits can include static random access memory (SRAM), read-only memory (ROM), and dynamic random access memory (DRAM), among others.
 
Read More

10 Most Important Tips For Physical Design Engineers

wafer

In this post, we will highlight some tips for a physical design engineer that they might find useful in their job:

 
1. A Script in Time Saves Nine

Just like any job, physical design can be repetitive. Scripting serves two purposes:
 

Automating repetitive tasks: Any

Read More

HDL Design House develops its first full SoC from architecture definition to tapeout for an external customer

news

April 27, 2023 — Belgrade, Serbia – HDL Design House, a leading provider of digital and analog design and verification services for the most complex SoC projects, announced today that they have successfully developed and implemented its first full SoC starting from architecture definition to tapeout phase. SoC is intended for

Read More

ESA and UKSA back EnSilica to develop satellite communications chip for terminals

Oxford, UK – 17 February 2023 – EnSilica (AIM:ENSI), a leading ASIC and mixed signal chip maker, has announced a contract to develop a new chip to address the next generation of mass market satellite broadband user terminals.
 
The contract has been awarded through the European Space Agency’s (ESA)

Read More

CEO Talk: Racheli Ganot, Founder and CEO, Ready Group

This interview was held with Racheli Ganot, Founder and CEO of Ready Group (formerly Rachip).
 

 
Tell me about Ready?
 
Ready Group (formerly Rachip) is an R&D 360 Firm, experts in end-to-end chip development, SW and HW for the semiconductor and high-tech industries. Ready Group teams have been

Read More

MOSCHIP joins TSMC Design Center Alliance

Hyderabad, India and Santa Clara, USA – Oct 17, 2022 – MosChip Technologies, a Semiconductor and Embedded system design services company, today announced that the company has joined the Design Center Alliance (DCA) of TSMC Open Innovation Platform® (OIP). The TSMC DCA focuses on chip-implementation services and system-level design solutions to help lower

Read More
Logo Image
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.