Category Archives: ASIC Design

HCLTech joins Samsung SAFE™ Program as a Design Solution Partner

NOIDA, India, Mar 27, 2025—HCLTech, a leading global technology company, has been selected as a Design Solution Partner (DSP) under the Samsung Advanced Foundry Ecosystem (SAFE™) program. This strategic partnership between HCLTech and Samsung is set to accelerate semiconductor innovation and development, leveraging HCLTech’s extensive expertise in Engineering and R&D

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imec to set up €40m chiplet development centre in Germany

chiplet

April-1, 2025 — imec, a world-leading research and innovation center in nanoelectronics and digital technologies, today announced the establishment of its Advanced Chip Design Accelerator (ACDA) in Baden-Württemberg, Germany. This €40 million center, funded over the next five years, will focus on accelerating the development and adoption of automotive chiplet technology,

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Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design

car

SANTA CLARA, Calif. — (BUSINESS WIRE) — March 24, 2025 — Silvaco Group, Inc. (Nasdaq: SVCO) (“Silvaco” or the “Company”), a provider of TCAD, EDA software, and SIP solutions that enable innovative semiconductor design and digital twin modeling through AI software and automation, today announced that Faraday Technology Corporation (TWSE: 3035) a leading provider

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Zero ASIC launches world’s first open standard eFPGA product

press release

Cambridge, MA – March 18, 2025 – Zero ASIC, a U.S. semiconductor startup on a mission to democratize silicon, has announced PlatypusTM, the world’s first open-standard eFPGA IP product. Platypus is the FIRST and ONLY commercial eFPGA IP products with:
 

100% open and standardized FPGA architectures
100% open source

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EnSilica Secures €2.13 Million European Space Agency Development Contract

March 6, 2025 – EnSilica plc (AIM:ENSI), a leading chip maker of mixed signal ASICs (“Application Specific Integrated Circuits”), is pleased to announce that it has been awarded a €2.13 million development contract under the European Space Agency’s (“ESA”) Navigation Innovation and Support Programme (“NAVISP”) Element 2 (the “Project”).
 
Under

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SignOff Semiconductors Unveils Expansion Plans with Its New Office in Penang, Malaysia

PENANG, Malaysia , Dec. 19, 2024  — SignOff Semiconductors Pvt. Ltd., headquartered in Bengaluru, India, and a leading provider of VLSI and Embedded Design services, is thrilled to announce the opening of its new office in Penang, Malaysia. This expansion enables the company to meet the growing demand for semiconductor chip design services from Fortune 500 companies operating in and expanding within Penang. It also aligns perfectly with the Malaysian government’s vision

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