Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced that its multi-protocol serializer/deserializer (SerDes) transceiver Physical Medium Attachment (PMA) intellectual property (IP) was part of Microsemi Corporation’s PolarFire field programmable gate array (FPGA), named 2017 “Product of the Year” by Electronics Products magazine, as well as
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Mobile Semiconductor today announced the introduction of its new 28nm memory compilers available immediately. Mobile Semiconductor’s silicon-proven embedded memory technology offers nine 28SLP GLOBALFOUNDRIES foundry sponsored compilers reaching all the way down to a 0.8V nominal power supply. Mobile Semiconductor also works with other top tier foundries delivering industry leading
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According to PR Newswire, being fueled by the rising demand for voice enabled devices, the global smart speaker market is likely to grow at a CAGR of 43.68% in terms of unit shipment during 2016–2022.
Early innovators as well as market leaders of these newly marketed products are demanding
Malaysian-based wafer foundry SilTerra Malaysia Sdn Bhd (Silterra) and Brazilian based Chipus Microeletrônica S.A. (Chipus) have jointly announced a partnership to provide analog IP solutions focusing on the Internet-of-Things (IoT) market for their mutual customers. This announcement marks a significant milestone of the multi-year collaboration between SilTerra and Chipus.
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Moortec, providers of In-Chip Monitoring PVT Subsystems solutions are pleased to announce that Canaan-Creative have employed Moortec’s In-Chip Monitoring Subsystem in their HPC IC.
Canaan-Creative is a worldwide leader in the design of high performance computing IC. “We have compared performance from other companies with Moortec’s and find that PVT
Flex Logix™ Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and software, announced today that three interconnect patents have been issued to Cheng Wang, co-founder of Flex Logix. These patents highlight the breakthrough interconnect technology that enables Flex Logix to design eFPGA in a new process node in ~six
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