Paris, France – May 19, 2025 – Foxconn Technology Group today unveiled a comprehensive €250 million investment plan in Europe, marking a strategic expansion into advanced semiconductor packaging, satellite manufacturing and electric vehicle production on the continent.
Key Highlights:
Joint Venture in Advanced Packaging: Foxconn will form
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May 13, 2025 —- TrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation. While ASE holdings and Amkor maintained leading positions, OSAT providers from China, such as JCET and HT-Tech,
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The DFN (Dual Flat No-leads) and its counterpart, the QFN (Quad Flat No-leads), are increasingly prevalent in high-performance applications. They’re favored for applications ranging from consumer electronics to automotive systems due to their ability to support advanced circuitry in a small footprint. Familiarizing yourself with these packages’ specifications can dramatically
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Palo Alto, CA – 25 March 2025. Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform
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BAYAN LEPAS, Malaysia, February 18, 2025–ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan Lepas Free Industrial Zone. The new plant is part of a strategic expansion plan that will expand the floor space of
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The semiconductor industry is experiencing a surge in investment and expansion of advanced packaging facilities, driven by increasing demand for high-performance computing and other applications. Several key players are significantly expanding their capacity, aiming for substantial production increases by 2025. This expansion is geographically diverse, with major projects underway in
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