Category Archives: Packaging

BGA Packaging Services – Find BGA Assembly Companies

Looking for a BGA packaging company for prototype, low-volume or production semiconductor assembly?
 

AnySilicon helps semiconductor companies connect with IC packaging and assembly providers offering wire-bond BGA, flip-chip BGA, FCBGA, FBGA and custom substrate-based packaging services worldwide.
 
Submit your die, substrate, package, ball-count and production-volume requirements and

QFN Packaging Services – Find a QFN Assembly Company

Looking for a QFN packaging company for prototype, low-volume or production assembly?
 
AnySilicon helps semiconductor companies connect with IC packaging and assembly providers offering standard and custom QFN packaging services worldwide.
 
Submit your die, package and volume requirements and AnySilicon can help identify suitable packaging partners for

Wafer Dicing Service | Silicon Wafer Dicing & Die Singulation

Find Qualified Wafer Dicing Suppliers for Your Semiconductor Project
Wafer dicing is a critical step in semiconductor manufacturing, where processed wafers are separated into individual dies or chips before packaging, assembly, testing or further processing. The dicing process must be accurate, clean and well controlled, as poor dicing can lead

TO-247 Package: Complete Guide for TO-247

What is a TO-247 Package?
The TO-247 package is a widely used through-hole semiconductor package designed for high-power applications. It is commonly used for devices such as MOSFETs, IGBTs, diodes, and power transistors that require efficient heat dissipation and high current handling.
 
TO-247 stands for “Transistor Outline 247”, and

Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona; Expands Investment to $7 Billion

TEMPE, Ariz.–(BUSINESS WIRE)–Oct. 6, 2025– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona.
 
The expanded investment includes additional cleanroom space

Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility

TEMPE, Ariz. — Aug. 28, 2025 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
 
The facility will be constructed on a 104-acre site within the Peoria