Find Qualified Wafer Dicing Suppliers for Your Semiconductor Project
Wafer dicing is a critical step in semiconductor manufacturing, where processed wafers are separated into individual dies or chips before packaging, assembly, testing or further processing. The dicing process must be accurate, clean and well controlled, as poor dicing can lead
What is a TO-247 Package?
The TO-247 package is a widely used through-hole semiconductor package designed for high-power applications. It is commonly used for devices such as MOSFETs, IGBTs, diodes, and power transistors that require efficient heat dissipation and high current handling.
TO-247 stands for “Transistor Outline 247”, and
TEMPE, Ariz.–(BUSINESS WIRE)–Oct. 6, 2025– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona.
The expanded investment includes additional cleanroom space
TEMPE, Ariz. — Aug. 28, 2025 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
The facility will be constructed on a 104-acre site within the Peoria
Kaohsiung, Taiwan – August 13, 2025 — ASE Group (Advanced Semiconductor Engineering), the world’s leading OSAT (Outsourced Semiconductor Assembly and Test) provider, has taken a bold step forward in meeting skyrocketing demand for advanced packaging by acquiring a facility from GaAs foundry WIN Semiconductors. The purchase, approved by the board
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Paris, France – May 19, 2025 – Foxconn Technology Group today unveiled a comprehensive €250 million investment plan in Europe, marking a strategic expansion into advanced semiconductor packaging, satellite manufacturing and electric vehicle production on the continent.
Key Highlights:
Joint Venture in Advanced Packaging: Foxconn will form
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