Category Archives: Packaging

AEMtec GmbH announces USA Tech Center Opening in Boston, MA.

Boston, MA – AEMtec GmbH from Berlin, Germany, a company widely known for its high precision microelectronic and Silicon Photonic assembly capabilities, announced today the September 1st opening of its anticipated Engineering Tech Center within the Boston University Photonics Center.
 
Says Robin Jerratsch, a highly skilled and experienced microelectronics

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Caliber Interconnect Solutions Joins AnySilicon Program

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AnySilicon, the leading marketplace for semiconductor service providers, announced today that Caliber Interconnect Solutions, a product engineering solutions company, has joined AnySilicon to promote its semiconductor engineering services. As part of the AnySilicon platform, Caliber will gain access to a full range of online marketing services to showcase its offering,

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Will an Adhesion Promoter Prevent Delamination in Power Semiconductor Packages?

Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is

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Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

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Meyreuil, France and San Jose, Calif., June 24, 2021—Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets. Presto is

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OSAT – Outsourced Semiconductor Assembly and Test

Figure 1 – OSAT Offering by Application and by Types of Packaging
 
What is OSAT?
 
OSAT stands for Outsourced Semiconductor Assembly and Test. This is a third-party service that suppliers around the world offer, which consists, as the name implies, of semiconductor assembly, packaging and testing of

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AEMTec Joins AnySilicon’s Marketing Platform

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AnySilicon, the leading marketplace for semiconductor service providers, announced today that AEMTec, a leading packaging and assembly services provider, has joined AnySilicon to promote its services. As part of the AnySilicon platform, AEMTec will gain access to a full range of online marketing services to showcase its offering, increase exposure

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