June 09, 2018, anysilicon
Consumer electronics markets, the mobile phone market in particular, are extremely demanding. They are driven by the desire to pack more and more functionality and enhanced value into the same size handheld device, and often at lower costs. This drive towards smaller, cheaper and thinner consumer electronics has driven the
Read MoreJune 06, 2018, anysilicon
We are happy to announce that Beckermus and IMI has signed a strategic cooperation agreement. The cooperation goals are focused on enhancing each party advantages and facilities to support clients’ needs.
In a nutshell, Beckermus will supply Integrated Micro-Electronics Inc. (IMI) with prototype assembly services for microelectronics, micro-optics, photonics and electro-optics and
April 16, 2018, anysilicon
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced that multiple factories have passed certification audits for IATF-16949:2016, a key certification required for manufacturers who supply products to the automotive market. IATF-16949:2016 replaces and supersedes the older ISO/TS-16949 standard.
April 03, 2018, anysilicon
Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole).
Will the fan-out market growth keep going? Who can challenge the leading semiconductor company, TSMC? Is panel technology coming? What will be the next
April 03, 2018, anysilicon
More than half of MEMS[1] packaging today is done by OSATs[2] and Yole Développement (Yole) estimates OSATs’ market share will continue to grow in the next five years. The MEMS volume augmentation, especially for RF[3] applications, is making the MEMS business more and more attractive for OSATs, which have started
Read MoreApril 03, 2018, anysilicon
According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR[1] over this period. The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1%
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