Category Archives: Packaging

Amkor Offers Optical Package Solutions for Multiple Applications

December 13, 2018, anysilicon

amkor smart package

Amkor Technology, a leading provider of outsourced semiconductor assembly and test (OSAT) services, today announced the extension of its MEMS and Sensor package platforms to address the growing optical market. The new optical package platforms are derivatives of our successful ChipArray® BGA and MicroLeadFrame® product families and can be used for many applications including

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Beckermus Technologies Announces Partnership with Engage Photonics

December 09, 2018, anysilicon

news

Beckermus Technologies was founded in 1998 and serves as an Excellence Center in the field of “Bare Die” assembly services for micro-electronic and micro-optical systems. Beckermus Technologies has been playing a vital role in the lifecycle of many products, for numerous companies worldwide, from early prototypes to mass production.
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IC Packaging: consumer solutions are adapted for automotive applications

November 23, 2018, anysilicon

market-forecast

“Automotive is the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy and comfort are the key words of the today’s automotive industry.
 
Under this dynamic context, the market research

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Amkor Introduces TOLL & PSMC Packages for Automotive Applications

November 13, 2018, anysilicon

car

The TOLL package is a highly efficient space-saving package featuring extremely low Rds(on) and strong thermal performance making it well suited for high current and high voltage applications. It meets an existing JEDEC package outline, is 30% smaller and 50% thinner than a DDPAK package. The TOLL package leads are designed with wettable flanks

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WLCSP Overview, Market and Applications

November 11, 2018, anysilicon

fan in wlcsp vs fan out wlcsp feature

Since the development of the first ASIC, the IC package was a mean to protect the silicon die and to provide means to PCB connectivity. Back then, the IC package was large and introduced various electrical parasitic.
 
WLCSP package is one of the latest and most impressive invention of

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Advanced Packaging Technologies are key for Semiconductor Innovation

October 25, 2018, anysilicon

Semicondcutor packaging history featured

“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly and Substrates at Yole Korea, part of Yole Développement (Yole). “The market grow by 21.6% year-to-year to reach record of almost US$412 billion”. Under this dynamic context, the advanced packaging industry is playing a key role, offering huge opportunities of

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