Category Archives: Packaging

TOP 25 OSATs Ranking 2018

July 03, 2019, anysilicon


The leading giant of the OSATs, ASE Technology Holding Co., Ltd. (formerly ASE Inc.) and subsidiaries, has just got even bigger after the official acquisition of SPIL on April 30 2018. In 2018e, ASE Technology Holding Co., Ltd and subsidiaries made a new record-high revenue of US $12,308 billion, which

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Short Guide to Selecting IC Package

March 29, 2019, anysilicon


Semiconductor integrated circuits (ICs) are an essential component of every other modern technology which is why they have undergone some of the most extensive growth. Today, IC packaging offering is wide and deep with many kinds and types of semiconductor packaging technologies.  Your goal is, therefore, to select an IC

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CEO Talk: Oliver Maiwald, Sencio B.V

February 20, 2019, anysilicon

This interview was held with Mr. Oliver Maiwald, CEO of Sencio B.V.
Tell me a bit about your background? How did you first get started with Sencio?
I have had a fairly circuitous route to the role of CEO. My first step was as an electrical technician working on the

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Fan-Out is becoming imperative to stay competitive within the advanced packaging industry

February 01, 2019, anysilicon

“Fan-Out Packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with FOPLP technology. Both companies have invested and developed FOPLP for

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An Introduction to BGA Package

January 15, 2019, anysilicon

With the levels of integration rising to unprecedented levels and the requirement of integrated circuits with a high number gate and pins increased day by day, there was a need to manufacture a package that would be convenient to use, would be will reliable and robust, would pose higher pin

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Amkor Offers Optical Package Solutions for Multiple Applications

December 13, 2018, anysilicon

Amkor Technology, a leading provider of outsourced semiconductor assembly and test (OSAT) services, today announced the extension of its MEMS and Sensor package platforms to address the growing optical market. The new optical package platforms are derivatives of our successful ChipArray® BGA and MicroLeadFrame® product families and can be used for many applications including

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