Category Archives: Packaging

Will an Adhesion Promoter Prevent Delamination in Power Semiconductor Packages?

Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is

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Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

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Meyreuil, France and San Jose, Calif., June 24, 2021—Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets. Presto is

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OSAT – Outsourced Semiconductor Assembly and Test

Figure 1 – OSAT Offering by Application and by Types of Packaging
 
What is OSAT?
 
OSAT stands for Outsourced Semiconductor Assembly and Test. This is a third-party service that suppliers around the world offer, which consists, as the name implies, of semiconductor assembly, packaging and testing of

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AEMTec Joins AnySilicon’s Marketing Platform

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AnySilicon, the leading marketplace for semiconductor service providers, announced today that AEMTec, a leading packaging and assembly services provider, has joined AnySilicon to promote its services. As part of the AnySilicon platform, AEMTec will gain access to a full range of online marketing services to showcase its offering, increase exposure

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Qmode project with QuiX

The Qmode project is funded with an MIT-R&D collaboration project grant from the Provincie Overijssel, dedicated to stimulate the innovation and development of products, processes and services of local SMEs working in the Dutch Top Sectors. The collaboration established in Qmode will help QuiX secure a leading position in the

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Amkor Factory Intelligence Enables Industry 4.0

TEMPE, Ariz., February 23, 2021 ― Amkor Technology, Inc. (Nasdaq: AMKR), a leader in advanced packaging technologies that support high-growth markets, including smartphones and 5G, advanced automotive systems, high-performance computing and consumer IoT, recently unveiled new measures that help the company achieve Industry 4.0 initiatives, extending its leadership in quality

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