Category Archives: Packaging

Steady growth in next-gen Fan-Out packaging

FO packaging revenue was US$1.86 billion in 2022. Yole Intelligence, part of Yole Group, expects it to have a CAGR of 12.5% through 2028, reaching US$3.8 billion. UHD FO will experience the fastest growth across all market classes, with a CAGR of 30%, growing from US$338 million in 2022 to

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Bonding Diagram Tool

Welcome to our QFN bonding diagram generator:
 

First select your package type and size
Enter your die size in um
Upload your netlist, here is a template
Questions? bugs? We’d love to hear

 

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Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe

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TEMPE, Ariz. and DRESDEN, Germany, February 16, 2023 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, and GlobalFoundries (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing, announced today that the two companies have formed a strategic partnership. This new partnership will enable

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Amkor Leverages Its Global Automotive Leadership to Support European Semiconductor Ecosystem

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TEMPE, Ariz. — October 24, 2022 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced its commitment to supporting European initiatives to achieve strategic regionalization for automotive semiconductors.
 
The proliferation of applications for automotive semiconductors continues to accelerate — from electrification,

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Automotive Chip Shortages – An Assembly Perspective

car

Since March 2020, the pandemic has brought on scarcity in odd goods like toilet paper, baking flour and exercise equipment. The latest casualty is the auto industry as car production across the world has been hobbled by chip shortages. While much has been written about the role of semiconductor suppliers,

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Introduction to System in Package (SiP)

System in Package (SiP) is a method used for bundling multiple integrated circuits (ICs) and passive components into a single package, under which they all work together. This contrasts to a System on Chip (SoC), whereas the functions on those chips are integrated into the same die.
 

Figure

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