Category Archives: Packaging

Advanced Packaging Technologies are key for Semiconductor Innovation

“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly and Substrates at Yole Korea, part of Yole Développement (Yole). “The market grow by 21.6% year-to-year to reach record of almost US$412 billion”. Under this dynamic context, the advanced packaging industry is playing a key role, offering huge opportunities of

Read More

JCET Group Appoints Distinguished Semiconductor Industry Executive Dr. Lee Choon Heung as CEO

STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, announced Friday that the Board of Directors of its holding company, Jiangsu Changjiang Electronics Technology Co., Ltd (‘JCET’) has appointed Dr. Lee Choon Heung as Chief Executive Officer (‘CEO’) for JCET

Read More

Amkor Opens New Semiconductor Package Manufacturing and Test Plant in Taiwan

Amkor Technology announced on September 10th the opening of its new manufacturing and test plant at Longtan Science Park in Taiwan.

“Demand for Amkor’s advanced assembly and test services in Taiwan continues to increase.  The opening of our fourth factory in Taiwan will allow us to keep

Read More

Choose Through Silicon Via (TSV) Packaging for Improved Performance

A smaller form-factor with higher data transfer rate, signal integrity, memory bandwidth, and thermal capability are all criteria for improving system performance. Today’s highly integrated and portable products strive to improve all of these metrics. Through Silicon Via (TSV) packaging technology enables homogenous and heterogeneous integration of logic and memory

Read More

Beckermus Adds a New Active Alignment Machine: ficonTEC CL1500

Innovative medical devices, autonomous vehicles, IoT applications, cloud based organizations, 5G communication networks and more high-end industries are basing their products on microelectronics and micro-optical components.
Constant reduction in chip size and uncompromising placement accuracy demands are some of the dominant challenges those industries are facing.
We, in Beckermus Technologies,

Read More

eWLB Package Overview

The eWLB (Embedded Wafer Level Ball Grid Array) package technology was developed in cooperation between 3 companies: Infineon, STMicroelectronics and STATS ChipPAC to solve an interconnect problem that was introduced by the fan-in packaging technology (WLCSP).
 
The first eWLB package was used in mobile phones in 2009 and since

Read More