Today, the (SiP) System-in-Package approach offers a new dimension to system integration, far beyond mere dense micro-packaging of existing System on Chip solutions. Not only does SiP offer the capability to integrate almost any kind of companion passive component with a given active circuit, but it also enables flexible combinations
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Semiconductor Packaging has become a critical factor to any semiconductor company success. Engineers have to select a semiconductor package effectively to both meet demanding price pressure but also system level performance requirements and size limitations.
Furthermore, with today’s price pressures – companies are spending more time in finding, selecting,
Antenna in Package (or AiP) is an new trend in IC packaging which is an enabler of smaller and high integrated ICs that consists of ICs and Antenna inside a package. Antenna in Package allows integration of all the complex RF components, together with the base-band circuitry into a complete
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The mobile sector is driving production and market growth; however a new market driver, IoT is on the horizon and is expected to have a significant impact on the advanced packaging industry. “IoT driven semiconductor industry consolidation, is reflecting into a highly dynamic advanced packaging landscape”, comments Andrej Ivankovic, Technology &
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For the packaging industry, the smartphone changed everything, and experts agree that more changes— potentially big ones—are underway.
Bill Chen, a senior fellow at ASE Group, said when personal computers ruled chip demand, the main components had fairly standard package formats. The pace of change has picked up in
Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of Flip Chip technology for LED and CMOS Image Sensors (CIS) applications, the Flip Chip market is expending. Under this context, more and more industrial companies including OSATs, IDMs IC foundries and
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