Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions today at 55th DAC 2018 announced release of its Embedded DisplayPort (eDP) receiver IP. DisplayPort offers high bandwidth, lower pin count and low power solutions for high-resolution displays. The Chip on Glass (COG) technology enables area
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This interview was conducted with Udi Shaked, CEO of Inomize.
Full Name: Udi Shaked
Title: CEO
Company: Inomize
Tell me a bit about your background. How did you first get started with Inomize?
We came up with the idea of launching Inomize back in 2007,
The eWLB (Embedded Wafer Level Ball Grid Array) package technology was developed in cooperation between 3 companies: Infineon, STMicroelectronics and STATS ChipPAC to solve an interconnect problem that was introduced by the fan-in packaging technology (WLCSP).
The first eWLB package was used in mobile phones in 2009 and since
T2M, the world’s largest independent global semiconductor IP technology provider today announced that they will be showcasing their latest Cellular and Low Power Wireless IoT technology IP at MWC Shanghai on 27, 28 and 29th June at the Shanghai New International Expo Centre.
Mobile World Congress Shanghai is the
ne of the key features of the Arm ecosystem is its open and collaborative nature, and that’s no more evident than in its bank of Approved Design Partners. They bring an additional layer of design expertise and capabilities to SoCs from Arm silicon partners, enabling them with more opportunities to
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The semiconductor industry is in constant growth and has a very promising future. Industry’s market experts have agreed the market size will grow even more in next decade. Some believe the IoT and Automotive market segments are the key growth and will eventually change our lives forever. After all, semiconductors
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Elsys with its comprehensive digital and mixed-signal SoC services and solutions stands for a reliable and agile design services company. Recognized on the market for its expertise and stability, Elsys has become a proud partner of Arm and IAR Systems.
Known for its best-in-class engineering support in domains of digital, analog and mixed-signal design,
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it will showcase their AI FPGA-to-ASIC solution and the Uranus+™ ultra-low-power IoT SoC development platform at Design Automation Conference (DAC), June 25-27, 2018 in San Francisco, CA, USA.
Faraday’s FPGA-to-ASIC conversion service has successfully completed several AI related
Consumer electronics markets, the mobile phone market in particular, are extremely demanding. They are driven by the desire to pack more and more functionality and enhanced value into the same size handheld device, and often at lower costs. This drive towards smaller, cheaper and thinner consumer electronics has driven the
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Dolphin Integration announces the availability in free download of its innovative IDE SmartVisionTM supporting the RISC-V Instruction Set Architecture (ISA).
A suitable software development environment is fundamental for optimizing designs in terms of power consumption, area (code density) and performances. Thanks to its IDE, Dolphin integration enables early in