Semiconductor Latest News

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T2M to showcase cutting-edge Cellular and Low Power Wireless IoT technologies at MWC Shanghai 2018

T2M, the world’s largest independent global semiconductor IP technology provider today announced that they will be showcasing their latest Cellular and Low Power Wireless IoT technology IP at MWC Shanghai on 27, 28 and 29th June at the Shanghai New International Expo Centre.
 
Mobile World Congress Shanghai is the

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Black Pepper Spices up the Arm Approved Design Partner Program

ne of the key features of the Arm ecosystem is its open and collaborative nature, and that’s no more evident than in its bank of Approved Design Partners. They bring an additional layer of design expertise and capabilities to SoCs from Arm silicon partners, enabling them with more opportunities to

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Semiconductor Market Size – History and Forecast

Silicone wafers

The semiconductor industry is in constant growth and has a very promising future.  Industry’s market experts have agreed the market size will grow even more in next decade. Some believe the IoT and Automotive market segments are the key growth and will eventually change our lives forever. After all, semiconductors

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Elsys exhibits at Design Automation Conference 2018

Elsys with its comprehensive digital and mixed-signal SoC services and solutions stands for a reliable and agile design services company. Recognized on the market for its expertise and stability, Elsys has become a proud partner of Arm and IAR Systems.
 
Known for its best-in-class engineering support in domains of digital, analog and mixed-signal design,

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Faraday Exhibits AI FPGA-to-ASIC Solution and IoT SoC Platform at DAC 2018

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it will showcase their AI FPGA-to-ASIC solution and the Uranus+™ ultra-low-power IoT SoC development platform at Design Automation Conference (DAC), June 25-27, 2018 in San Francisco, CA, USA.
 
Faraday’s FPGA-to-ASIC conversion service has successfully completed several AI related

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Understanding Wafer Bumping Packaging Technology

wafer bumping feature

Consumer electronics markets, the mobile phone market in particular, are extremely demanding. They are driven by the desire to pack more and more functionality and enhanced value into the same size handheld device, and often at lower costs. This drive towards smaller, cheaper and thinner consumer electronics has driven the

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Dolphin Integration makes its innovative IDE SmartVision, free for download for the RISC-V ecosystem

Dolphin Integration announces the availability in free download of its innovative IDE SmartVisionTM supporting the RISC-V Instruction Set Architecture (ISA).
 
A suitable software development environment is fundamental for optimizing designs in terms of power consumption, area (code density) and performances. Thanks to its IDE, Dolphin integration enables early in

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IMI global and Beckermus Cooperation

Partnership

We are happy to announce that Beckermus and IMI has signed a strategic cooperation agreement. The cooperation goals are focused on enhancing each party advantages and facilities to support clients’ needs.
 
In a nutshell, Beckermus will supply Integrated Micro-Electronics Inc. (IMI) with prototype assembly services for microelectronics, micro-optics, photonics and electro-optics and

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Sankalp Semiconductor to Exhibit at Design Automation Conference – 2018

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting at DAC from 25-27th June in Moscone, San Francisco. Sankalp offers services and solutions to its customers in key semiconductor domains including digital, analog, mixed signal, custom layout, standard cell development,

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Who’s Managing Your IC Power Management?

Today’s complex systems employ a wide variety of semiconductor technologies. From the deepest sub nanometer processors to the Analog I/O, it’s easy to see the need for power management devices for 1.0V, 1.2V, 1.5V, 1.8V, 2.2V, 2.5V, 2.8V, 3.0V, 3.3V and more, all in the same box.
 
Dozens of

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