Semiconductor Latest News

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The Impact of Trump’s “Liberation Day” Tariffs on the Semiconductor Industry

Direction Uncertainty

President Trump’s announcement of sweeping new tariffs, dubbed “Liberation Day,” on April 2nd, 2025, has sent shockwaves through the global economy, with significant implications for the semiconductor industry. The 10% universal tariff and the country-specific reciprocal tariffs, reaching as high as 34% for some nations, will undoubtedly reshape the landscape

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imec to set up €40m chiplet development centre in Germany

chiplet

April-1, 2025 — imec, a world-leading research and innovation center in nanoelectronics and digital technologies, today announced the establishment of its Advanced Chip Design Accelerator (ACDA) in Baden-Württemberg, Germany. This €40 million center, funded over the next five years, will focus on accelerating the development and adoption of automotive chiplet technology,

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Taiwan chipmaker UMC launches US$5 billion wafer fab facility in Singapore; 700 jobs to be created

Press Release PR

April-1, 2025 — United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today announced the official opening of its new 22nm wafer fabrication facility (fab) in Singapore’s Pasir Ris Wafer Fab Park. The grand opening ceremony was attended by high-ranking Singaporean officials, including Deputy Prime Minister Gan Kim Yong and

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The Future of Semiconductors: A Deep Dive with Bill Finch (CAST)

Deep Dive Interview

This interview features Bill Finch, Senior Vice President,  CAST (Computer-Aided Software Technology Inc.)
 
Can you describe your company’s founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
 
CAST was founded in the early 1990s by a group of EDA veterans who

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Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design

car

SANTA CLARA, Calif. — (BUSINESS WIRE) — March 24, 2025 — Silvaco Group, Inc. (Nasdaq: SVCO) (“Silvaco” or the “Company”), a provider of TCAD, EDA software, and SIP solutions that enable innovative semiconductor design and digital twin modeling through AI software and automation, today announced that Faraday Technology Corporation (TWSE: 3035) a leading provider

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Power Semiconductor Giants amid Struggles: 8,800+ Layoffs as Market Slows and China Emerges

news

TrendForce, March 26, 2025 — Once a rising star alongside AI chips, power semiconductors are now feeling the heat from a sluggish EV market. According to ijiwei, citing Nikkei, major players are slashing jobs and pushing back investments, with layoffs topping 8,800.
 
Power semiconductors, vital for EV range and home

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FuriosaAI Rejects $800 Million Acquisition Offer from Meta, Opts for Independent Growth

news

SEOUL, SOUTH KOREA – March 25, 2025 – South Korean AI chip startup FuriosaAI has declined an $800 million acquisition offer from US tech giant Meta, choosing instead to pursue its vision as an independent company
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Discussions between FuriosaAI and Meta had been ongoing since early this year, with

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Sarcina Technology launches AI platform To enable cost-effective customizable packaging solutions for AI applications

Sarcina Technology semiconductor packaging platform PR image

Palo Alto, CA – 25 March 2025. Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform

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TSMC on Track for 2nm Production, Expected to Power Apple’s iPhone 18 in 2026

girls holding a phone

March 24, 2025 – Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, is making significant strides in its 2nm process technology, paving the way for its adoption in Apple’s iPhone 18 family, expected in the second half of 2026.
 
Recent reports indicate that TSMC has been steadily

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Cadence Silicon Success of UCIe IP on Samsung Foundry’s 5nm Automotive Process

chiplet

21 Mar 2025 – We are thrilled to announce that Cadence has successfully demonstrated first-pass silicon success of its UCIe™ standard package IP on Samsung Foundry’s 5nm automotive process. This milestone underscores our commitment to delivering high-performance, automotive-grade IP solutions that meet the stringent requirements of next-generation automotive and high-performance computing

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