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OpenAI CEO Sam Altman is leading a $150 million funding round for Rain AI, a semiconductor startup aiming to rival Nvidia’s dominance in the AI chip market. This investment, valuing Rain AI at $600 million, follows a $25 million seed round in 2022 where Altman was a major investor. Rain
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BRANFORD, Conn. and BLOOMINGTON, Minn. – November 20, 2024 – Quantum-Si Incorporated (Nasdaq: QSI) (“Quantum-Si,” or “QSI”), The Protein Sequencing Company™ and SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, announced today they will jointly expand their relationship to support the development of Proteus, Quantum-Si’s next-generation platform designed to transform proteomic research.
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Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence’s commitment to driving industry-leading solutions through its chiplet architecture and framework.
The First System Chiplet
In a significant leap forward,
Embedded non-volatile memories (eNVM) are memory blocks that are directly integrated semiconductor fabrication on the same die. Since eNVM memories are non-volatile, the data is retained even when the power is off. In addition, eNVMs are reprogrammable and erasable multiple times. Compared to external non-volatile memory technologies, eNVMs have lower
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Migdal Haemek, Israel – November 13, 2024 – Tower Semiconductor (NASDAQ: TSEM & TASE: TSEM) today announced its financial results for the third quarter ended September 30, 2024, reporting continued growth and a significant investment in future capacity.
Third Quarter Highlights:
Revenue reached $371 million, a 6% increase
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Woodcliff Lake, New Jersey — November 19, 2024—Semiconductor intellectual property provider CAST, in collaboration with Silesia Devices, today announced a new IP core that implements the Serial Peripheral Interface for Automotive Safety (SafeSPI), an emerging open standard that adds Functional Safety and interoperability features to the de-facto Serial Peripheral Interface
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Introduction to Gate-All-Around (GAA) Transistors
Gate-all-around (GAA) transistors are a newly introduced type of transistor structure: the gate terminal connects with the channel on all sides. Gate-All-Around transistors are a multi-gate field effect transistors type where a silicon nanowire gate moves around the channel by further scaling down FinFET. The
[Nov 12, 2024] – Japanese Prime Minister Shigeru Ishiba today announced a substantial new investment plan totaling over JPY10 trillion (approximately US$87 billion) for the nation’s semiconductor and artificial intelligence industries by fiscal year 2030. This ambitious initiative aims to stimulate a total of JPY50 trillion (approximately US$346 billion) in
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SoC designs are everywhere in our lives. From smartphones and laptops to smart home devices and automobiles, SoCs power a vast array of electronic devices. The demand for increasingly sophisticated and interconnected devices fuels the rapid growth of the semiconductor industry. SoC design can be found in the following products:
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[November 11, 2024] – Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading contract chipmaker, announced today it is suspending production of advanced artificial intelligence (AI) chips for Chinese customers, effective Monday. This action follows a U.S. Department of Commerce directive to halt shipments of advanced chips to Chinese companies, pending
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