Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
asicNorth, the premier VLSI design services and turnkey mixed-signal ASIC provider is thrilled to announce it has been able to help StretchSense Ltd. bring their unique sensor technology to market driving wearables to become “disappearables”. Their client and investor Start Today Co. Ltd. recently announced the launch of the ZozoSuit,
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The BCD process technology has been around since the mid-eighties, but there has more recently been phenomenal interest and growth in BCD technology. This has been driven by the growing need in Power Management IC (PMICs), motor-control, power audio and many other applications targeting the consumer, industrial or automotive
If you were uncertain about the term “FlipChip” this tutorial will help you better understand what FlipChip packaging technology is all about.
FlipChip package technology has been around for 3-4 decades and started as a package solution for high pin count & high performance package requirements. At the
For the first time since 1993, the semiconductor industry is expected to witness a new number 1 supplier. Samsung first charged into the top spot in 2Q17 and displaced Intel, which had held the number 1 ranking since 1993. In 1Q16, Intel’s sales were 40% greater than Samsung’s, but in
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Siemens has entered into an agreement to acquire Saskatoon, Canada-based Solido Design Automation Inc., a leading provider of variation-aware design and characterization software to semiconductor companies worldwide. Solido’s machine learning-based products are currently used in production at over 40 major companies, enabling them to design, verify, and manufacture more competitive
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Since its invention in the `60s, integrated circuit development has seen an aggressive and cyclic pace for improvement pushed by specific disruptive applications. These once were military/aerospace, mainframe computer, minicomputer, personal computers, networking, mobile and more recently smartphones. The traditional approach has always been to make the most out of
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Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has acquired nusemi inc, a company focused on the development of ultra-high-speed Serializer/Deserializer (SerDes) communications IP.
SerDes solutions enable high-speed communications between chips, backplane and long-haul optical interconnect by converting between parallel data and extremely high-speed serial data streams with
Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, today received an award from Software Technology Parks of India (STPI) for being the Highest Exporter – ITES in the Hubballi Region award. Sankalp Semiconductor has consecutively third time won the award. According to
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UltraSoC today announced that Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, has licensed UltraSoC’s universal analytics and embedded intelligence platform for use in an expanding range of Microsemi products based on the RISC-V open source processor architecture.
This latest engagement for UltraSoC extends
Open-Silicon today announced the availability of a comprehensive IP subsystem targeted at high-bandwidth networking applications. The subsystem expands on Open-Silicon’s existing high speed chip-to-chip Interlaken interface IP to include Ethernet Physical Coding Sublayer (PCS), Flex Ethernet (FlexE) and multi-channel multi-rate Forward Error Correction (FEC) IPs targeted for Ethernet endpoint and
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