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TSMC has recently updated its VCA (Value Channel Aggregator) program so we thought it would be beneficial to review TSMC VCA program and update our readers with the program benefits and value proposition.
As you all know — TSMC is a pure-play foundry and as such, it’s offering wafer
This interview was held with Scott Bulbrook, Managing Partner, VP of Engineering at DA-Integrated.
Tell me a bit about your background? How did you first get started with DA-Integrated?
I have always had a passion for the semiconductor industry. At university Semiconductor Physics was my favorite course. I
Flex Logix™ Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and software, announced today that three interconnect patents have been issued to Cheng Wang, co-founder of Flex Logix. These patents highlight the breakthrough interconnect technology that enables Flex Logix to design eFPGA in a new process node in ~six
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Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology
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G-ray Medical Sàrl, a Neuchâtel startup, is currently developing an ultra-high performance detector dedicated to medical applications and in particular mammography. These ultra-high performance detectors will be made in partnership with CSEM, based on G-ray’s revolutionary lateniumTM technology. Centred on particle-counting X-ray imaging, this unique solution is set to improve
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Dream Chip Technologies announced today record power efficiency of its ADAS System-on-Chip (SoC) for automotive computer vision applications, fabricated on GLOBALFOUNDRIES’s 22FDX® semiconductor process at the foundry’s Fab 1 facility in Dresden, Germany.
The SoC was created in close cooperation with Arm, ArterisIP, Cadence, GLOBALFOUNDRIES, and INVECAS as part
This is an interview with Claude Joseph Cloutier, President and Chief Executive Officer with XtremeEDA Corporation.
Tell me a bit about your background? How did you first get started with your XtremeEDA?
I started out my work career in 1978 as an Air Navigator in the Canadian Air Force
Andes Technology Corporation, the leading Asia-based supplier of small, low-power, high performance 32/64-bit embedded CPU cores, today announced that Solid State System Co., Ltd. (3S) has licensed the mid-range AndesCore™ N903A for the SSS6131 USB 3.1 Gen 1 flash controller chip. The chip is being designed into USB flash drives
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Communications Consultants Worldwide Ltd. (CCww), global innovator of 3GPP® technologies, has licensed its NB-IoT protocol-stack software to WuQi Technologies Inc., a leading global developer of highly integrated mixed-signal SoC solutions, and the latest licensee of CCww’s NB-IoT Release 13 UE protocol-stack software. Communications Consultants Worldwide (CCww) is working with WuQi
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CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, today unveiled its new RivieraWaves RW-AX family of 802.11ax Wi-Fi intellectual property (IP), targeting client devices, the smart home and network infrastructure. Building on its market leadership in Wi-Fi IP, CEVA
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