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TEMPE, Ariz. and VILA DO CONDE, Porto, Portugal, February 2, 2017 – Amkor Technology, Inc. (Nasdaq: AMKR) and NANIUM S.A. today announced that they have entered into a definitive agreement for Amkor to acquire NANIUM, a world class provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction
Read MoreAquantia Corp., a pioneer and market leader in high-speed Ethernet connectivity solutions for data centers, enterprise infrastructure and client connectivity, today announced the AQcite product line of FPGA-programmable Multi-Gigabit Ethernet Physical Layer (PHY) devices, integrating Aquantia’s AQrate BASE-T PHY with a Xilinx® Kintex®-7 FPGA. The new AQcite product line targets
Read MoreAnySilicon, the fast-growing semiconductor marketplace has announced today the availability of a new service allowing decision makers to receive instant price proposals from ASIC Design Companies, Semiconductor Foundries, Assembly and Test companies, and IP Core Vendors.
AnySilicon new service allows companies to easily receive price quotes and evaluate
San Jose, Calif. – January 25, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced it will collaborate with GLOBALFOUNDRIES on energy processing unit (EPU) product development that leverages the power and performance optimization capabilities of the 22FDX® process
Read MoreYou may have heard of wafer sort or wafer testing, which is a part of the testing process performed on silicon wafers. Wafer sort is a simple electrical test, that is perform on a silicon die while it’s in a wafer form. Wafer sort’s main purpose is to identify the
Read MoreThe industry’s focus on battery-powered devices sets new expectations in terms of energy saving for a wide range of applications such as IoT, wearables and wireless MCUs. Meeting the underlying low-power challenge requires a new class of silicon IPs to enable unmatched power consumption figures and new IoT SoC architectures
Read MoreHsinchu, Taiwan — Jan. 19 2017 — Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, has received the certificate of ISO 26262 (Road vehicles-functional safety) from SGS-TÜV Saar on its design development process. Faraday is the first ASIC design service company in the world approved
Read MoreeInfochips, a leading Product Engineering and Software R&D services firm, recently announced that the company was rated in the “Leadership Zone” for Semiconductor services by Zinnov, in its annual “Zinnov Zones 2016 PES” ratings. eInfochips was also recognized under “Execution Zone” for Aerospace, Industrial Automation, Medical Devices, and Consumer Software.
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The continued growth of the mobile handset, tablet, and networking markets requires ongoing development of innovative packaging technologies. The required solutions must provide reduced form factor and high thermal and electrical performance as well as increased functional convergence and system integration. To meet the extremely small interconnect feature sizes in
Read MoreThe pure-play semiconductor foundry market is forecast to play an increasingly stronger role in the worldwide IC market during the next five years, according to IC Insights’ new 2017 McClean Report, which becomes available later this month. The 20th anniversary edition of The McClean Report forecasts that the 2016-2021 pure-play
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