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The world’s largest contract chip maker, Taiwan Semiconductor Manufacturing Co (TSMC), is being expected to secure more than half of all of Apple’s new mobile chip in 2016. This is due to their better production roadmap planning. They’re expecting that since the Taiwanese manufacturer has a clear roadmap for their
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The tech world was buzzing during last October when IBM agreed to pay GlobalFoundries $1.5 billion to take over their semiconductor manufacturing facilities in East Fishkill and Vermont. The deal is now expected to close as of July 1st.
The closing of the deal will put to end months
Integrated circuit (IC) designers are learning that a technique long used on older process nodes is providing even more valuable benefits as they develop devices to be manufactured at advanced technology nodes, including 28nm and beyond. During a period when it takes $10 million or more to bring a device
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The war between TSMC and Samsung is heating up and it’s expected to last well throughout the decade. The war only got hotter when TSMC announced that they will begin producing 7nm processors in 2017. Xilinx will be their very first customer.
Xilinx Inc. made the announcement late yesterday that
Semiconductor wafer is absolutely invisible in our daily life but it exists in a form of an ASIC or an IC in each and every electronic device we use. Semiconductor wafer is a round piece of silicon which consists of silicon dies that are designed to perform a very specific
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The 14nm technology development between Samsung and GlobalFoundries that started last year is now reaching its final step by releasing the availability schedule of the process technology including the 2 main flavors.
The primary concept of the strategic collaboration is to make 14nm FinFET technology available at
“The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore’s law in its foundation”, asserts Andrej Ivankovic, Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement
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Lidless BGA package essentially offers one main advantage compared to a heatspreader-BGA packages: better thermal performance. The second advantage of the lidless BGA is lower cost due to the fact that a heatspreader is not used in lidless BGA configuration. This article will cover the thermal properties of the lidless
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Within the second half 2015 China Jianguang will complete the acquisition of NXP’s RF Power Unit for $1.8B. For some analysts this was a necessary strategic step as a result of the acquisition of FreeScale Semiconductor that has as well a similar unit.
The buyer is Jianguang Asset Management
Avago Technologies , the Singaporean chipmaker that started out as a division of Hewlett Packard (HP), is in advanced negotiations to acquire American chip manufacturer Broadcom, which makes chips for about half tablet computers and smartphones worldwide, its customers include Amazon, Apple, Google and Samsung , reported the newspaper “Wall
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