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Necessity is the mother of invention. For the semiconductor industry, the emergence of Multi-Project Wafers (MPWs) is no exception to the rule. This fundamental enabler of affordable IC fabrication emerged in the 1970’s to help university researchers and silicon entrepreneurs prototype their Integrated Circuits (ICs) and demonstrate their work. It
Read MoreOn a yearly basis, AnySilicon provides a snapshot of top semiconductor foundries wafer capacity, based on available data on their website. In our last yearly report , we have presented semiconductor foundries capacity ranking of the top 4 pure-play wafer fabs: TSMC, GLOBALFOUNDRIES, UMC and SMIC. This year, our report has
Read MoreIP cores availability and quality have become a critical factor to any SoC design success. Engineers have to find and qualify different IP cores quickly and effectively to help boost time to market and reduce the need of unnecessary re-spins. Moreover, with today’s aggressive time to market demands and the
Read MoreThe semiconductor industry was a bit puzzled last year when Amazon acquired Annapurna Labs (Israel) for $350 million; the analysts believed that Amazon is planning to use Annapurna’s chips in its own data centers. But now it turns out that Amazon is taking advantage of the deal to enter the
Read MoreThe mobile sector is driving production and market growth; however a new market driver, IoT is on the horizon and is expected to have a significant impact on the advanced packaging industry. “IoT driven semiconductor industry consolidation, is reflecting into a highly dynamic advanced packaging landscape”, comments Andrej Ivankovic, Technology &
Read MoreIC Insights has released its Global Wafer Capacity 2016-2020 report that provides in-depth detail and analysis of foundry ranking capacity by wafer size, by process geometry, by region, and by product type. The new report provides a ranking of the industry’s 25 largest IC manufacturers and foundries in terms of installed
Read MoreFor the packaging industry, the smartphone changed everything, and experts agree that more changes— potentially big ones—are underway.
Bill Chen, a senior fellow at ASE Group, said when personal computers ruled chip demand, the main components had fairly standard package formats. The pace of change has picked up in
The 3C’s of verification i.e. Constraints, Checkers & Coverage have been playing an important role enabling faster verification closure. With growing complexity and shrinking market windows it is important to introduce the 4th C that can be a game changer in actually differentiating your product development life cycle. Interestingly the 4th C
Read MoreOptimal+, a leader in Manufacturing Intelligence solutions, today announced that it was selected by Freescale® Semiconductor to deliver their enterprise software suite to enhance the efficiency of their global manufacturing operations. In a move intended to improve the utilization of Freescale’s manufacturing equipment worldwide, the two companies signed a multi-year
Read More[Press Release] AnySilicon, the fastest-growing semiconductor marketplace has announced today the availability of a free semiconductor hotline service offering expert-level answers to technical and commercial ASIC questions. Using this free service companies can better meet schedule and budget objectives and avoid wrong decisions due to lack of information.
The hotline