Semiconductor Latest News

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Multi Project Wafer – History, Overview & Booking System

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Multi Project Wafer (MPW) emerged in the 1970’s to help companies and researchers prototype their silicon and demonstrate their work. It was the early days of the semiconductor industry when firms like Fairchild, IBM and others were applying technology innovation to create smaller, faster and cheaper chips. Back then, Multi-Project

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Semiconductors Could Revolutionize Food Preperation

There are many methods employed in food preparations right from the Stone Age up till date, these methods have been increasingly evolving and getting better with time.
 
Food preparations started from burying food in the ground for the heat to cook it up, this goes on till the invention

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AnySilicon Launches new site with IP portal Capabilities

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AnySilicon the leading semiconductor marketplace launched today an IP portal linking IP core vendors and companies in search of IP cores. AnySilicon IP marketplace is covering analog, digital, mixed signal and verification IP cores together with more critical IPs provided by leading IP vendors. AnySilicon site allows companies to easily

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TSMC to Secure Major Apple A10 Chip Orders in 2016

girls holding a phone

The world’s largest contract chip maker, Taiwan Semiconductor Manufacturing Co (TSMC), is being expected to secure more than half of all of Apple’s new mobile chip in 2016. This is due to their better production roadmap planning. They’re expecting that since the Taiwanese manufacturer has a clear roadmap for their

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IBM, GlobalFoundries Deal to To Close July 1st

The tech world was buzzing during last October when IBM agreed to pay GlobalFoundries $1.5 billion to take over their semiconductor manufacturing facilities in East Fishkill and Vermont. The deal is now expected to close as of July 1st.
 
The closing of the deal will put to end months

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Focused Ion Beam (FIB)

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Integrated circuit (IC) designers are learning that a technique long used on older process nodes is providing even more valuable benefits as they develop devices to be manufactured at advanced technology nodes, including 28nm and beyond. During a period when it takes $10 million or more to bring a device

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Xilinx Expected to Introduce new 7nm Products in 2017

The war between TSMC and Samsung is heating up and it’s expected to last well throughout the decade. The war only got hotter when TSMC announced that they will begin producing 7nm processors in 2017. Xilinx will be their very first customer.
Xilinx Inc. made the announcement late yesterday that

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Semiconductor Wafer – Overview and Facts

Semiconductor wafer is absolutely invisible in our daily life but it exists in a form of an ASIC or an IC in each and every electronic device we use. Semiconductor wafer is a round piece of silicon which consists of silicon dies that are designed to perform a very specific

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GLOBALFOUNDRIES Release Schedule for 14nm

The 14nm technology development between Samsung and GlobalFoundries that started last year is now reaching its final step by releasing the availability schedule of the process technology including the 2 main flavors.
 

 
The primary concept of the strategic collaboration is to make 14nm FinFET technology available at

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WLP Manufacturing Capacities, Growth and Forecast

“The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore’s law in its foundation”, asserts Andrej Ivankovic, Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement

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