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Research in the field of 2D materials that started approximately five years ago, focusing on developing materials that are one layer thick which would make it faster for atoms to move in a single layer. Currently, transistors and other components used in electronic devices have been made of 3D materials
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Semiconductor industry spending on research and development grew by just 0.5% in 2015, which was the smallest increase since the 2009 downturn year and significantly below the compound annual growth rate (CAGR) of 4.0% in R&D expenditures during the last 10 years, according to IC Insights’ new 2016 edition of The
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Today, the (SiP) System-in-Package approach offers a new dimension to system integration, far beyond mere dense micro-packaging of existing System on Chip solutions. Not only does SiP offer the capability to integrate almost any kind of companion passive component with a given active circuit, but it also enables flexible combinations
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SilabTech, leading supplier of High Speed Interface intellectual property designs (IPs), announced today that it was awarded with the 2015 IESA Award for the Most Innovative Product for its High Speed Interface (SERDES) Design which is leading the industry in its Low Power figures while enabling customers to use it in wide variety
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As the ASIC design is moving towards maskset creation and tapeout, the cost of design changes are increasing exponentially. It’s easier and cheaper to modify the ASIC design and even redo some of the chip architecture early the design stage. However it’s much more difficult and far more expensive after
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The top semiconductor buyers of 2015 where once again Apple and Samsung Electronics. According to Gartner, the leading information technology, marketing research and advisory firm in America, Apple and Samsung accounted for 17.7% of the market. Together the two consumed a total of 59 billion dollars of semiconductors for the
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Semiconductor Packaging has become a critical factor to any semiconductor company success. Engineers have to select a semiconductor package effectively to both meet demanding price pressure but also system level performance requirements and size limitations.
Furthermore, with today’s price pressures – companies are spending more time in finding, selecting,
Antenna in Package (or AiP) is an new trend in IC packaging which is an enabler of smaller and high integrated ICs that consists of ICs and Antenna inside a package. Antenna in Package allows integration of all the complex RF components, together with the base-band circuitry into a complete
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TowerJazz, announced today that it completed its previously announced acquisition of an 8-inch wafer fabrication facility in San Antonio, Texas, United States from Maxim Integrated Products, Inc. (NASDAQ:MXIM). This acquisition will expand TowerJazz’s current worldwide manufacturing capacity, cost-effectively increasing its production by about 28,000 wafers per month. The availability of
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According to sources, chipmaker Qualcomm is laying off today a few dozen of employees in the company’s development center in Israel. The layoffs are part of a worldwide cutback of 15% of its total work force that was announced by the company in July 2015 to help the company save
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