Semiconductor Latest News

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SoC Manufacturing and Test Trends

Technology Trends
 
Process technology is progressing at a very fast pace and 16/14nm FinFET- based SOCs are available from various fabless companies. Significant investments in the development of advanced technology nodes are being made to ensure that future demands are met. This makes fab utilization of primary importance.

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The IP licensing business model. A love story.

This article will give you a breakdown of the IP licensing model, describing the major players and the relationships between them. It is not designed to be a complete guide by any means and some parts might already sound familiar, but I hope it is a comprehensive overview that can

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Comparing Au, Pt, Ag and Cu Wire Bonding

copper wire

With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the cost of ball bonding. Recently, the trend has been to look into the use copper wire. However, there are many drawbacks to using copper wire, including the short shelf

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UMC Expects Wafer Shipment to Drop

UMC’s CEO, Po-Wen Yen, confirmed the drop of 5% on wafer shipment performance for the third quarter of 2015. The CEO justified this forecast  by referring to a restricted market visibility and to weaknesses in the demand due to the uncertain economic environment. Not only, Po-Wen-Yen mentioned also the inventory

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ARM has acquired Israel-based Sansa Security

ARM has acquired Israel-based Sansa Security, a provider of hardware security IP and software for advanced system-on-chip components deployed in Internet of Things (IoT) and mobile devices. The company currently enables security in more than 150 million products a year and Sansa Security technology is deployed across a range of

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Intel is in trouble…but so are TSMC and Samsung

I recently read an interesting article “Intel’s cost cuts could give rivals higher ground: analysts” where the analysis claims that Intel Corp’s move to delay the launch of its next generation chip technology to 2017 may see the company lose ground to rivals Taiwan Semiconductor Manufacturing Co and Samsung Electronics

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Fabless-Foundry model vs. Integrated Device Manufacturers Model

I authored my first book “Mass Capitalism : A Blueprint for Economic Revival” in 2014 with a purpose of letting the global semiconductor industry ( and particularly the US Semiconductor Industry) know that the Semiconductor Industry is headed for a monumental transformation in the very near future due to a

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Stack Die (3D IC) Assembly – Drivers and Challenges

With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital cameras and laptop computers—original equipment manufacturers (OEMs) and integrated device manufactures (IDMs) have joined forces to ensure enhanced chip performance without sacrificing valuable board real estate. Rather than use conventional single chip

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TSMC slashes 20nm and 28nm pricing by up to 10%

tsmc

Taiwan Semiconductor Manufacturing Company (TSMC) has dropped its prices on 28nm and 20nm process technologies by 5-10% in hopes to secure additional orders from major companies which includes Qualcomm and MediaTek, according to DigiTimes. However, the reaction of 28nm prices will most likely affect AMD and Nvidia positively, who are

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Semiconductor IP Market worth $5.63 Billion by 2020

growth

The Semiconductor IP marketplace is a two digit rate growing market which should continue its increase next years according to Gartner Dataquest and according to a new market research report by Form Factor.
 
Semiconductor IP is expected to reach $5.63 billion in 2020 at a CAGR of 12.6% from

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