Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
GlobalFoundries (GF), a leading semiconductor manufacturer, has been awarded up to $1.5 billion in funding under the US CHIPS and Science Act. This significant investment, part of GF’s larger $13 billion plan to expand its US production capacity over the next decade, will bolster domestic chip production and address critical
Read More
OpenAI CEO Sam Altman is leading a $150 million funding round for Rain AI, a semiconductor startup aiming to rival Nvidia’s dominance in the AI chip market. This investment, valuing Rain AI at $600 million, follows a $25 million seed round in 2022 where Altman was a major investor. Rain
Read More
BRANFORD, Conn. and BLOOMINGTON, Minn. – November 20, 2024 – Quantum-Si Incorporated (Nasdaq: QSI) (“Quantum-Si,” or “QSI”), The Protein Sequencing Company™ and SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, announced today they will jointly expand their relationship to support the development of Proteus, Quantum-Si’s next-generation platform designed to transform proteomic research.
Read More
Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence’s commitment to driving industry-leading solutions through its chiplet architecture and framework.
The First System Chiplet
In a significant leap forward,
Embedded non-volatile memories (eNVM) are memory blocks that are directly integrated semiconductor fabrication on the same die. Since eNVM memories are non-volatile, the data is retained even when the power is off. In addition, eNVMs are reprogrammable and erasable multiple times. Compared to external non-volatile memory technologies, eNVMs have lower
Read More
Migdal Haemek, Israel – November 13, 2024 – Tower Semiconductor (NASDAQ: TSEM & TASE: TSEM) today announced its financial results for the third quarter ended September 30, 2024, reporting continued growth and a significant investment in future capacity.
Third Quarter Highlights:
Revenue reached $371 million, a 6% increase
Read More
Woodcliff Lake, New Jersey — November 19, 2024—Semiconductor intellectual property provider CAST, in collaboration with Silesia Devices, today announced a new IP core that implements the Serial Peripheral Interface for Automotive Safety (SafeSPI), an emerging open standard that adds Functional Safety and interoperability features to the de-facto Serial Peripheral Interface
Read More
Introduction to Gate-All-Around (GAA) Transistors
Gate-all-around (GAA) transistors are a newly introduced type of transistor structure: the gate terminal connects with the channel on all sides. Gate-All-Around transistors are a multi-gate field effect transistors type where a silicon nanowire gate moves around the channel by further scaling down FinFET. The
[Nov 12, 2024] – Japanese Prime Minister Shigeru Ishiba today announced a substantial new investment plan totaling over JPY10 trillion (approximately US$87 billion) for the nation’s semiconductor and artificial intelligence industries by fiscal year 2030. This ambitious initiative aims to stimulate a total of JPY50 trillion (approximately US$346 billion) in
Read More
SoC designs are everywhere in our lives. From smartphones and laptops to smart home devices and automobiles, SoCs power a vast array of electronic devices. The demand for increasingly sophisticated and interconnected devices fuels the rapid growth of the semiconductor industry. SoC design can be found in the following products:
Read More