Semiconductor Latest News

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X-FAB First Quarter 2025 Results

April 29-2025 — TESSENDERLO-HAM, Belgium-Regulatory News:
X-FAB (BOURSE:XFAB):
 
Highlights Q1 2025:

Revenue was USD 204.1 million, down 6% year-on-year (YoY) and up 8% quarter-on-quarter (QoQ)
Excluding the impact from revenue recognized over time (IFRS 15), revenue was USD 202.3 million, well within the guided range of USD 195-205 million
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STMicroelectronics Published Q1 2025 Financial Results

STMicroelectronics has announced its financial results for the first quarter of 2025, reflecting both the challenges of a shifting market and the company’s strategic transformation efforts.

 
This memo summarizes STMicroelectronics’ Q1 2025 financial results, as announced. While revenues were down 27.3% year-over-year to $2.52 billion, aligning with

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Intel Expands Foundry Ecosystem With TSMC, UMC, and Taiwanese IP Partners

Intel’s new CEO, Lip-Bu Tan, concluded his first earnings call, signaling a strong commitment to the company’s transformation. This transformation includes a strategic blend of internal manufacturing and external partnerships, notably with TSMC. Intel’s upcoming Nova Lake CPU will leverage both Intel’s own fabs and TSMC’s manufacturing capabilities, optimizing production

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The Future of Semiconductors: A Deep Dive with Scott Bulbrook

This interview features Scott Bulbrook, President of DA-Integrated.
 

 
Can you describe your company’s founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
 
DA-Integrated was founded to address a gap in the industry concerning the availability of test development services

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New Audio Sample Rate Converter (ASRC) IP Core from CAST Offers Versatility with High Fidelity

press release

Woodcliff Lake, New Jersey — April 29, 2025 — Semiconductor intellectual property core provider CAST today introduced a high-performance Audio Sample Rate Converter (ASRC) IP core that delivers real-time and batch-mode sample rate conversion with exceptional signal integrity, ultra-low distortion, and unmatched scalability. The company believes the new Audio Sample

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UCIe™ — Universal Chiplet Interconnect Express

chiplet

UCIe, is a pivotal player in modern chip design that places emphatic power on high-bandwidth data transfer, efficient heat management, and reduced leakage. This standard features bioinspired advancements, system co-optimization, and integration with cutting-edge 3D packaging, which together revolutionize AI, high-performance computing, and consumer electronics. Alongside optical I/O advancements, UCIe

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Premier ASIC and SoC Design Partner Rebrands as Aion Silicon

READING, U.K. – April 28, 2025 – Aion Silicon (formerly Sondrel), a premier ASIC/SoC architecture and design partner, today officially unveiled its new name, vision, and leadership team. The company is leveraging decades of experience to deliver advanced System-on-Chip (SoC) solutions and tailored ASIC services that help customers navigate the complex challenges

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Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions

TSMC building

Santa Clara, CA / April 23, 2025 – Certus Semiconductor, a leading provider of custom I/O and ESD Solutions to the semiconductor industry, is announcing an official partnership to join the TSMC Intellectual Property (IP) Alliance program, a key element of the TSMC Open Innovation Platform® (OIP).
 

Certus Semiconductor,

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Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge

news

SAN JOSE, Calif., April 24, 2025 /PRNewswire/ — QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP and user tools, ruggedized FPGAs, and endpoint AI/ML solutions, today announced that its eFPGA IP is now integrated into Faraday Technology Corporation’s cutting-edge FlashKit™-22RRAM SoC Development Platform. The collaboration gives

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TSMC Unveils Next-Generation A14 Process at North America Technology Symposium

TSMC

SANTA CLARA, Calif.– April 23, 205 –TSMC (TWSE: 2330, NYSE: TSM) today unveiled its next cutting-edge logic process technology, A14, at the Company’s North America Technology Symposium. Representing a significant advancement from TSMC’s industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power

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